2004
DOI: 10.1063/1.1776615
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Removal of thick (>100nm) InGaN layers for optical devices using band-gap-selective photoelectrochemical etching

Abstract: Vertically oriented GaN-based air-gap distributed Bragg reflector structure fabricated using band-gap-selective photoelectrochemical etching

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Cited by 53 publications
(48 citation statements)
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“…This is a process in which photogenerated holes enhance the oxidation of the GaN, with the oxide subsequently dissolved in the electrolyte (water), leading to a slight etching of the material 21 . In this work, we carried out an experiment to directly validate this model, by masking a portion of the microdisk to mark changes in its geometry during the water-based tuning process.…”
mentioning
confidence: 99%
“…This is a process in which photogenerated holes enhance the oxidation of the GaN, with the oxide subsequently dissolved in the electrolyte (water), leading to a slight etching of the material 21 . In this work, we carried out an experiment to directly validate this model, by masking a portion of the microdisk to mark changes in its geometry during the water-based tuning process.…”
mentioning
confidence: 99%
“…An airgap of the order of 1 µm was achieved with this technology, which is large enough to minimize interactions with the substrate and related light losses. The possibility of producing large airgaps is an advantage of dry RIE as compared to doping-selective and bandgapselective PEC etching and with different III-nitride sacrificial layers ensuring a limited airgap thickness of only a few hundreds of nanometers [55][56][57]. This issue is particularly critical for structures operating in the near infrared.…”
Section: Technologies For the Fabrication Of Pc Structures (A Comparimentioning
confidence: 99%
“…Some developper (AZ400 in which the active component is KOH) employed in lithography are also known to etch the wurtzite layers 9 . Another solution is to developp a band-gap selective photoelectrochemical etching 10 . It is a potential way to stop etching at a level optimized for collection of carriers.…”
Section: Etching Of Basal Algan Layermentioning
confidence: 99%