Reliability of PBGA assemblies under out-of-plane vibration excitations

Abstract

Vibration testing of plastic ball grid array (PBGA) assemblies to assess the reliability of the solder joints under external vibration excitations was reported in this paper. The test vehicle was an assembly with four 256 I/Os PBGA modules assembled on a printed circuit board (PCB). During the test, the assembly was clamped at two opposite sides to a vibration shaker. It was found that the dynamic displacement of the assembly under external out-of-plane sinusoidal vibration excitations was highly nonlinear. In order to determine the reliability of the solder joints, the resistance of each module was continuously monitored during the test. Under an out-of-plane sweep sinusoidal excitation with a constant acceleration amplitude of 2.5 G within a narrow frequency band around the fundamental resonant frequency of the assembly, the first-time-to-failure and mean-time-to-failure of the solder joints were found to be 0.46 and 6.19 million vibration cycles respectively. The failed solder joints were at the corners of the PBGA module. Most failures were due to cracks near the copper pad on the PCB side.Index Terms-Electronic packaging, plastic ball grid array (PBGA), reliability, vibration.

High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

“…4 was constructed with the commercial software ANSYS 11. According to the reliability assessment work of the PBGA assembly [16,4], the vibration fatigue failure always occurred at the corner solder balls of the package under the vibration loading. Therefore, solder balls at the four corners of the BGA were modeled in detail while equivalent cubes were used to represent all other solder balls in this model.…”

Finite element based fatigue life prediction for electronic components under random vibration loading

“…3 is constructed with the commercial software ANSYS 11. According to the reliability assessment work of the PBGA assembly [10,11], the vibration fatigue failure always occurred at the corner solder balls of the package under the vibration loading. Therefore, solder balls at the corner were modeled in detail while equivalent cubes were used to represent all other solder balls in this work.…”

PBGA packaging reliability assessments under random vibrations for space applications

“…Dasgupta et al [9] used a sinusoidal vibrations increasing from 0.1 g 2 /Hz to 0.4 g 2 /Hz for the durability tests. Yang et al [10] also employed a sinusoidal vibration excitement to find the first failure of the PBGA assemblies experimentally. On the other hand, Yu et al [11] considered random vibration loading of PSD with 0.15 g 2 /Hz and 0.25 g 2 /Hz over a frequency range of 40 and 1000 Hz.…”