“…An effort has been made to transfer this technology to e-textile; however, due to textile substrate low-temperature resistance, dimension instability, large areas of character, and poor wettability, textile-based conductors create difficulties that limit the soldering in e-textile applications. There are other interconnection techniques that are more compatible with textiles (Table 2), such as sewing of electronic modules on flexible polyamide foil by conductive yarns [27,28], manual low-temperature soldering by bismuth solder [29,30], ultrasonic welding [31][32][33], resistance welding [34], and joining by conductive or nonconductive UV-cured and melt adhesives [35][36][37] conductive silver-plated hook and loop strips [25,36,38], snap fasteners [39][40][41], the 3D-printed press-fit socket using filaments filled by carbon [42], etc. However, all these techniques also have certain weaknesses, such as the instability of electrical contact resistance based on the gradual loosening of fibers of yarns of sewed contacts, increasing electrical resistance due to the silver tendency to peel off quickly out of hook and loop strips, the high electrical contact resistance of carbon-filled filaments for 3D printing, cost of adhesives, or the risk of some electrical components becoming damaged during ultrasonic welding interconnection process.…”