Reliability of Glued SMD Components on Smart Textile

Hirman, Martin; Navrátil, Jǐŕı; Steiner, František; Hamáček, Aleš

doi:10.1109/isse49702.2020.9121133

Cited by 3 publications

(5 citation statements)

References 3 publications

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“…Only few studies have reported the direct integration of such components on the resulting textile conductive tracks. A conventional method such as soldering has been considered and presented by Hirman et al, [ 18 ] Koshi et al, [ 19 ] and Molla et al [ 20 ] . Since textile is a heat‐sensitive substrate, soldering should be realized at a much lower temperature than in the electronic industry.…”

Section: Introductionmentioning

confidence: 99%

“…Bonding of components with different adhesive types has also been considered: isotropically conductive adhesive (ICA), [ 19 ] anisotropically conductive adhesive (ACA), [ 21 ] and nonconductive adhesive (NCA). [ 18 ] Further works on the integration of microelectronics for e‐textiles can be found in a recent extensive review from Simegnaw et al [ 22 ] .…”

Section: Introductionmentioning

confidence: 99%

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Textile Electronic Circuits from Laser‐Patterned Conductive Fabric

et al. 2023

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Textile electronics have shown very promising results in remote health monitoring or personal thermal management. Meanwhile, textile‐based generators are researched to harvest energy from human motion and supply the electronics required for signal acquisition and transmission. Hence, there is a need to fully integrate electronic circuits directly onto textile to achieve self‐powered smart garments. Herein, a thermoadhesive conductive fabric is considered to realize textile electronic circuits. A laser‐based method is developed to pattern the circuit design. After optimizing the spatial resolution, the electrical and mechanical resistances of the resulting textile conductive tracks are evaluated. Heterogeneous interconnections with rigid electronic components are considered with different methods such as soldering and bonding. The interconnections are characterized and compared regarding their electrical contact resistances. Finally, demonstrators are realized to show a proof of concept of “textronic circuits.”

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Textile Electronic Circuits from Laser‐Patterned Conductive Fabric

et al. 2023

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“…An effort has been made to transfer this technology to e-textile; however, due to textile substrate low-temperature resistance, dimension instability, large areas of character, and poor wettability, textile-based conductors create difficulties that limit the soldering in e-textile applications. There are other interconnection techniques that are more compatible with textiles (Table 2), such as sewing of electronic modules on flexible polyamide foil by conductive yarns [27,28], manual low-temperature soldering by bismuth solder [29,30], ultrasonic welding [31][32][33], resistance welding [34], and joining by conductive or nonconductive UV-cured and melt adhesives [35][36][37] conductive silver-plated hook and loop strips [25,36,38], snap fasteners [39][40][41], the 3D-printed press-fit socket using filaments filled by carbon [42], etc. However, all these techniques also have certain weaknesses, such as the instability of electrical contact resistance based on the gradual loosening of fibers of yarns of sewed contacts, increasing electrical resistance due to the silver tendency to peel off quickly out of hook and loop strips, the high electrical contact resistance of carbon-filled filaments for 3D printing, cost of adhesives, or the risk of some electrical components becoming damaged during ultrasonic welding interconnection process.…”

Section: Introductionmentioning

confidence: 99%

Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials

et al. 2023

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Nowadays, a range of sensors and actuators can be realized directly in the structure of textile substrates using metal-plated yarns, metal-filament yarns, or functionalized yarns with nanomaterials, such as nanowires, nanoparticles, or carbon materials. However, the evaluation or control circuits still depend upon the use of semiconductor components or integrated circuits, which cannot be currently implemented directly into the textiles or substituted by functionalized yarns. This study is focused on a novel thermo-compression interconnection technique intended for the realization of the electrical interconnection of SMD components or modules with textile substrates and their encapsulation in one single production step using commonly widespread cost-effective devices, such as 3D printers and heat-press machines, intended for textile applications. The realized specimens are characterized by low resistance (median 21 mΩ), linear voltage–current characteristics, and fluid-resistant encapsulation. The contact area is comprehensively analyzed and compared with the theoretical Holm’s model.

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“…Hirman et al [ 16 , 17 ] focused in their research on connecting SMDs onto textile ribbons by UV curable NCA. The ribbons had silver coated copper threads inside.…”

Section: Introductionmentioning

confidence: 99%

“…The ribbons had silver coated copper threads inside. Even after several washing, temperature and load cycles they dedicated a reliable connection between the electronics and the ribbon [ 16 , 17 ].…”

Section: Introductionmentioning

confidence: 99%

Automatic Joining of Electrical Components to Smart Textiles by Ultrasonic Soldering

Micus

Haupt

Gresser

2021

Sensors

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A suitable connection method to automatically produce E-textiles does not exist. Ultrasonic soldering could be a good solution for that since it works with flux-free solder, which avoids embrittlement of the textile integrated wires. This article describes the detailed process of robot-assisted ultrasonic soldering of e-textiles to printed circuit boards (PCB). The aim is to understand the influencing factors affecting the connection and to determine the corresponding solder parameters. Various test methods are used to evaluate the samples, such as direct optical observation of the microstructure, a peeling tensile test, and a contact resistance measurement. The contact strength increases by reducing the operating temperature and the ultrasonic time. The lower operating temperature and the reduced ultrasonic time cause a more homogeneous metal structure with less defects improving the mechanical strength of the samples.

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Reliability of Glued SMD Components on Smart Textile

Cited by 3 publications

References 3 publications

Textile Electronic Circuits from Laser‐Patterned Conductive Fabric

Textile Electronic Circuits from Laser‐Patterned Conductive Fabric

Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials

Automatic Joining of Electrical Components to Smart Textiles by Ultrasonic Soldering

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