Reliability modelling of PEM fuel cells with hybrid Petri nets

Vasilyev, Andrey; Andrews, John; Jackson, Lisa M.; Dunnett, Sarah J.

doi:10.1201/9781315210469-363

Cited by 3 publications

(3 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The survivability of the system was evaluated by using model checking on the PN model. Vasilyev et al (2017) used hybrid Petri nets for reliability modelling of polymer electrolyte membrane (PEM) fuel cell systems. Li et al (2016c) proposed a PN-based reliability modelling method when system reliability was evaluated considering the dependence of failure mechanism.…”

Section: Applications As Standalone Approachesmentioning

confidence: 99%

Applications of Bayesian networks and Petri nets in safety, reliability, and risk assessments: A review

2019

View full text Add to dashboard Cite

System safety, reliability and risk analysis are important tasks that are performed throughout the system lifecycle to ensure the dependability of safety-critical systems. Probabilistic risk assessment (PRA) approaches are comprehensive, structured and logical methods widely used for this purpose. PRA approaches include, but not limited to, Fault Tree Analysis (FTA), Failure Mode and Effects Analysis (FMEA), and Event Tree Analysis (ETA). Growing complexity of modern systems and their capability of behaving dynamically make it challenging for classical PRA techniques to analyse such systems accurately. For a comprehensive and accurate analysis of complex systems, different characteristics such as functional dependencies among components, temporal behaviour of systems, multiple failure modes/states for components/systems, and uncertainty in system behaviour and failure data are needed to be considered. Unfortunately, classical approaches are not capable of accounting for these aspects. Bayesian networks (BNs) have gained popularity in risk assessment applications due to their flexible structure and capability of incorporating most of the above mentioned aspects during analysis. Furthermore, BNs have the ability to perform diagnostic analysis. Petri Nets are another formal graphical and mathematical tool capable of modelling and analysing dynamic behaviour of systems. They are also increasingly used for system safety, reliability and risk evaluation. This paper presents a review of the applications of Bayesian networks and Petri nets in system safety, reliability and risk assessments. The review highlights the potential usefulness of the BN and PN based approaches over other classical approaches, and relative strengths and weaknesses in different practical application scenarios.

show abstract

Section: Applications As Standalone Approachesmentioning

confidence: 99%

Applications of Bayesian networks and Petri nets in safety, reliability, and risk assessments: A review

2019

View full text Add to dashboard Cite

show abstract

“…Therefore, at present, the actual issue is determining the reliability of the vias at the design stage, depending on its parameters and on the PCB manufacturing process. Currently, two main approaches to reliability estimation can be highlighted [9]: probabilistic-statistical and physico-chemical.…”

Section: Introductionmentioning

confidence: 99%

“…The second approach (physico-chemical or physics of failures) is related to the research on the causes and processes that cause failures of electronic devices. Mechanisms of typical failures are identified, on the basis of which models of failures are developed, taking into account the influence not only of operating time but also of design and manufacturing factors, state of production, and influence of external impacts [9,14,15]. The results of research in this direction give an opportunity to develop methods of engineering calculations, making it possible already at the stage of designing to optimize designs of electronic devices by reliability criterions, to reasonably formulate requirements for the material and manufacturing equipment, and to predict reliability metrics.…”

Section: Introductionmentioning

confidence: 99%

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs

Korobkov,

Vasilyev,

Khomutskaya

2023

Inventions

View full text Add to dashboard Cite

Currently, there is a need to increase the density of interconnections on printed circuit boards (PCBs). Does this mean that the only option for quality PCB manufacturing is to proportionally increase precision of equipment, or is there another way? One of the main constraints on increasing the density of PCB interconnections is posed by the transition holes. As the number of conductive layers increases, the number of vias increases and they cover a significant space on the PCB. On the other hand, reducing the size of the vias is limited by the capability of spatial alignment of the PCB stack during manufacturing. There are standards that set limits for the design of contact pads on a PCB (IPC-A-600G, IPC-6012B). However, depending on the precision of production, the contact pads may be of poor quality. This raises the issue of determining the reliability of a contact pad with defined parameters at the design stage, taking into account manufacturing capabilities. This research proposes an analytical method for evaluation of reliability of a via or plated through-hole based on calculation of its probability of production in accordance with the current standards. On the basis of the method, a model was developed both for the case of a contact pad without any conductors connected to it (nonfunctional contact pad) and for the real case with a connected conductor. The model estimates the probability of making an acceptable via for a given reliability class depending on parameters such as the conductor width (minimum permissible and usable), drilled hole diameter, and pad diameter, as well as the accuracy of the drilling operation. The analysis of the modeling results showed that for the real case, a reduction in the reliability class would insignificantly affect the probability of making an acceptable via due to the tight limitation on the connection place of the conductor and the contact pad. In conclusion, we propose an algorithm for determining the optimal parameters of teardrops to minimize the negative impact of the conductor on the reliability of the vias.

show abstract

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on the PCB

Korobkov,

Vasilyev,

Khomutskaya

2023

Preprint

View full text Add to dashboard Cite

Nowadays there is a need to increase the density of interconnections on printed circuit boards (PCBs). Does this mean that the only way out for quality PCB manufacturing is to proportional increase in precision of equipment, or is there another way? One of the main constraints to increasing the density of PCB interconnections is the transition holes. As the number of conductive layers increases, the number of vias increases and they cover a significant space on the PCB. On the other hand, reducing the size of the vias is limited by the capability of spatial alignment of the PCB stack during manufacturing. There are standards that set limits for the design of contact pads on a PCB (IPC-A-600G, IPC-6012B). However, depending on the precision of production, the contact pads may be of poor quality. This raises the issue of determining the reliability of a contact pad with defined parameters at the design stage, taking into account manufacturing capabilities. This research proposes an analytical method for evaluation of reliability of a via or plated through-hole based on calculation of its probability of production in accordance with the current standards. On the basis of the method a model was developed both for the case of a contact pad without any conductors connected to it (nonfunctional contact pad) and for the real case with a connected conductor. The model estimates the probability of making an acceptable via for a given reliability class depending on parameters such as the conductor width (minimum permissible and usable), drilled hole diameter and pad diameter, as well as the accuracy of the drilling operation. The analysis of the modeling results showed that for the real case, a reduction in the reliability class would insignificantly affect the probability of making an acceptable via due to the tight limitation on the connection place of the conductor and the contact pad. In conclusion, we propose an algorithm for determining the optimal parameters of teardrops to minimize the negative impact of the conductor on the reliability of the vias.

show abstract

Reliability modelling of PEM fuel cells with hybrid Petri nets

Cited by 3 publications

References 13 publications

Applications of Bayesian networks and Petri nets in safety, reliability, and risk assessments: A review

Applications of Bayesian networks and Petri nets in safety, reliability, and risk assessments: A review

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on the PCB

Contact Info

Product

Resources

About