Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs
Maksim A. Korobkov,
Fedor V. Vasilyev,
Olga V. Khomutskaya
Abstract:Currently, there is a need to increase the density of interconnections on printed circuit boards (PCBs). Does this mean that the only option for quality PCB manufacturing is to proportionally increase precision of equipment, or is there another way? One of the main constraints on increasing the density of PCB interconnections is posed by the transition holes. As the number of conductive layers increases, the number of vias increases and they cover a significant space on the PCB. On the other hand, reducing the… Show more
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