Reliability design for exposed pad and low-profile leadframe package

Yang, Ying; Zhang, X. R.; Wang, Zhu; Teddy, J. C.; Liang, Yukai; Nathapong, S.; Surasit, C.

doi:10.1109/icept.2010.5582882

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging 2010

DOI: 10.1109/icept.2010.5582882

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Reliability design for exposed pad and low-profile leadframe package

Ying Yang¹,

X. R. Zhang²,

Zhu Wang³

et al.

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Cited by 2 publications

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Reliability design for exposed pad and low-profile leadframe package

Cited by 2 publications

References 7 publications

A case study of package delamination with combination of EDX and MiniSIMS

A case study of package delamination with combination of EDX and MiniSIMS

Interfacial delamination and reliability design of exposed pad packages

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