A case study of package delamination with combination of EDX and MiniSIMS

Zhang, Haishu; Xue, Ming

doi:10.1109/eptc.2013.6745751

Cited by 2 publications

(1 citation statement)

References 9 publications

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“…In particular, QFNs used for the engine management or under the hood [7] strongly require highly reliable performance and without defects including delamination since the area under the hood generates high temperature, which directly influences the quality and reliability of the QFN package [8]. Delamination is the main problem for IC packaging [9][10][11][12][13][14] including QFN due to the mismatch in the coefficient of thermal expansions between dissimilar materials, leading to delamination and affecting the product quality [15][16][17][18][19]. The adhesion between the leadframe and epoxy molding compound interfacing is a major factor that affects the quality of the product in terms of the delamination [20][21][22].…”

Section: Introductionmentioning

confidence: 99%

Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices

2020

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This research studied about an effect of epoxy molding compound material and roughness leadframe of integrated circuit package for automotive device. In manufacturing process, the epoxy molding compound material and leadframe roughness are main factors that effect to coefficient of thermal expansion (CTE) and reliability for automotive device package with no delamination in high temperature application. In experiment, two types of epoxy molding compound materials were studied and compared between standard and roughened leadframe for quad flat non lead (QFN) package. For reliability test, the epoxy molding compound materials type A and type B with different leadframe were analyzed with moisture sensitivity level 1 to observe delamination inside packages. The results showed that CTE of epoxy molding compound material type A is less CTE mismatch than that of epoxy molding compound material type B with both standard and roughness leadframe. Moreover, the results also found no delamination for epoxy molding compound material type A with roughened leadframe. In addition, both epoxy molding compound materials showed significant delamination inside packages with standard leadframe.

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