2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging 2012
DOI: 10.1109/icept-hdp.2012.6474688
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Interfacial delamination and reliability design of exposed pad packages

Guofeng Xia
1
,
Fei Qin
2
,
Zhu Wang
3
et al.
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Cited by 4 publications
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Cohesive zone experiments for copper/mold compound delamination

Krieger
1
,
Raghavan
2
,
Kwatra
3
et al. 2014
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
8
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4
0
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Cohesive zone experiments for copper/mold compound delamination

Krieger
1
,
Raghavan
2
,
Kwatra
3
et al. 2014
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
8
1
4
0
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Effect of thermal aging on cohesive zone models to study copper leadframe/mold compound interfacial delamination

Kwatra
1
,
Samet
2
,
Sitaraman
3
2015
2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
5
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6
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Experiments for Obtaining Cohesive-Zone Parameters for Copper-Mold Compound Interfacial Delamination

Krieger
1
,
Raghavan
2
,
Sitaraman
3
2016
IEEE Trans. Compon., Packag. Manufact. Technol.
32
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