Cohesive zone experiments for copper/mold compound delamination

Krieger, William E. R.; Raghavan, Sathyanarayanan; Kwatra, Abhishek; Sitaraman, Suresh K.

doi:10.1109/ectc.2014.6897408

Cited by 8 publications

(5 citation statements)

References 27 publications

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“…As indicated by Kwatra et al [ 8 ], the maximum traction and initial stiffness for a Mode I loading EMC–copper interface are, respectively, 30 MPa and 126,422 MPa/mm. A similar study was conducted by Krieger et al [ 9 ], where similar values for both parameters were found. In the context of semiconductors, Raghavan et al [ 10 ] studied the cohesive properties of silicon and BEOL (BEOL stands for “back-end of line”, which consists of copper layers intersected by low-k dielectric materials), where they found 1.8 MPa and 10,000 MPa/mm for the maximum traction and initial stiffness, respectively.…”

Section: Introductionsupporting

confidence: 84%

“…As presented in the literature, the scatter of results is a common phenomenon, mainly due to the brittle nature of the silicon and also the multiple thin layers that exist in Type II specimens. Values for

in copper–EMC interfaces vary from 0.036 to 0.060 N/mm [ 8 , 9 , 23 , 24 ]. Kwatra et al [ 8 ] studied the thermal aging effects on EMC–copper leadframe interfacial adhesion in microelectronic packages using cohesive zone models.…”

Section: Resultsmentioning

confidence: 99%

“…Kwatra et al [ 8 ] studied the thermal aging effects on EMC–copper leadframe interfacial adhesion in microelectronic packages using cohesive zone models. Krieger et al [ 9 ] introduced a framework using cohesive zone theory for crack propagation modeling without pre-existing cracks. The method is demonstrated on a copper/epoxy interface, showcasing the determination of cohesive zone parameters through experimental methods.…”

Section: Resultsmentioning

confidence: 99%

“…Modified cohesive zone parameters for polymers were introduced by Kwatra et al [ 8 ], showcasing the ability of the cohesive zone modeling (CZM) approach to capture load–displacement plots in microelectronic packages featuring an EMC on a copper leadframe. The mixed-mode fracture of EMC–copper was also analyzed by Krieger et al [ 9 ] using the CZM approach. They introduced a framework for determining mixed-mode cohesive zone parameters through experimental methods.…”

Section: Introductionmentioning

confidence: 99%

“…All the mentioned studies utilize cohesive interactions for interface modeling. However, Krieger et al [ 9 ] opted to utilize VCCT in another analysis. There is still a lack of information about the silicon–EMC and EMC–polyimide interfaces, although the values found in the literature for similar interfaces are useful in setting values for comparison.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach

Adler,

Morais,

Akhavan-Safar

et al. 2024

Materials

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Examining crack propagation at the interface of bimaterial components under various conditions is essential for improving the reliability of semiconductor designs. However, the fracture behavior of bimaterial interfaces has been relatively underexplored in the literature, particularly in terms of numerical predictions. Numerical simulations offer vital insights into the evolution of interfacial damage and stress distribution in wafers, showcasing their dependence on material properties. The lack of knowledge about specific interfaces poses a significant obstacle to the development of new products and necessitates active remediation for further progress. The objective of this paper is twofold: firstly, to experimentally investigate the behavior of bimaterial interfaces commonly found in semiconductors under quasi-static loading conditions, and secondly, to determine their respective interfacial cohesive properties using an inverse cohesive zone modeling approach. For this purpose, double cantilever beam specimens were manufactured that allow Mode I static fracture analysis of the interfaces. A compliance-based method was used to obtain the crack size during the tests and the Mode I energy release rate (GIc). Experimental results were utilized to simulate the behavior of different interfaces under specific test conditions in Abaqus. The simulation aimed to extract the interfacial cohesive contact properties of the studied bimaterial interfaces. These properties enable designers to predict the strength of the interfaces, particularly under Mode I loading conditions. To this extent, the cohesive zone modeling (CZM) assisted in defining the behavior of the damage propagation through the bimaterial interfaces. As a result, for the silicon–epoxy molding compound (EMC) interface, the results for maximum strength and GIc are, respectively, 26 MPa and 0.05 N/mm. The second interface tested consisted of polyimide and silicon oxide between the silicon and EMC layers, and the results obtained are 21.5 MPa for the maximum tensile strength and 0.02 N/mm for GIc. This study’s findings aid in predicting and mitigating failure modes in the studied chip packaging. The insights offer directions for future research, focusing on enhancing material properties and exploring the impact of manufacturing parameters and temperature conditions on delamination in multilayer semiconductors.

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Section: Introductionsupporting

confidence: 84%