2013
DOI: 10.1016/j.egypro.2013.07.275
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Relationships between Diffusion Parameters and Phosphorus Precipitation during the POCl3 Diffusion Process

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Cited by 48 publications
(40 citation statements)
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“…We use the value of n ieff = n i = 8.27 × 10 9 cm −3 (see Table I) in the bulk consistently throughout this work for conductive boundary modeling, neglecting the small amount of bandgap planar with some scattering, modeled by Phong reflection with R 0 = 0.7 and w = 4 [45], [46] metal grid front fingers 75 fingers with 2.08-mm-pitch, 60-μm-wide, and 12-μm-high rectangular shape Ag-paste with 4.5-μΩ · cm resistivity contact resistivity 2-mΩ · cm 2 lumped series resistance: 0.312 Ω · cm 2 front busbars 3 busbars, 1300-μm-wide and 15-μm-high Ag-paste with 4.5-μΩ · cm resistivity lumped series resistance: neglected rear metal full area Al-paste with 35-μΩ · cm resistivity, 30-μm-high contact resistivity 5-mΩ · cm 2 lumped series resistance: neglected electrical properties bulk 2-Ω · cm p-type mc mid-gap SRH lifetimes τ n = τ p = 75 μs front n + diffusion lumped inputs sheet resistance 75 Ω (70-90) recombination parameter J 0 passivated: 201 fA/cm 2 (150-300) contacted: 204 fA/cm 2 (200-600) depth 0.39 μm collection efficiency 0.85 (0.8-0.9). detailed inputs doping profile total and active concentration from [38], see Appendix B surface SRH passivated: S p = 6.63 × 10 6 cm/s, S n = 1 × 10 7 cm/s (derived from [39] with texture multiplier of 1.73) contacted: S p = S n = 1 × 10 7 cm/s (thermal velocity) volume SRH modeled via inactive phosphorus profile according to [39] and a texture multiplier of 1.73 rear p + region lumped inputs sheet resistance 30 Ω (20-40) recombination parameter J 0 = 517 fA/cm 2 (300-700) depth 7-μm collection efficiency 0.7 detailed inputs doping profile measured active concentration from [40] with incomplete ionization model from [45], see Appendix B surface SRH S p = S n = 1 × 10 7 cm/s (thermal velocity) volume SRH modeled as in [41] with parameters in [42] narrowing. J 0 values derived with a different assumption of n ieff are scaled according to J 0 /n ieff 2 = const [22].…”
Section: General Input Parametersmentioning
confidence: 99%
“…We use the value of n ieff = n i = 8.27 × 10 9 cm −3 (see Table I) in the bulk consistently throughout this work for conductive boundary modeling, neglecting the small amount of bandgap planar with some scattering, modeled by Phong reflection with R 0 = 0.7 and w = 4 [45], [46] metal grid front fingers 75 fingers with 2.08-mm-pitch, 60-μm-wide, and 12-μm-high rectangular shape Ag-paste with 4.5-μΩ · cm resistivity contact resistivity 2-mΩ · cm 2 lumped series resistance: 0.312 Ω · cm 2 front busbars 3 busbars, 1300-μm-wide and 15-μm-high Ag-paste with 4.5-μΩ · cm resistivity lumped series resistance: neglected rear metal full area Al-paste with 35-μΩ · cm resistivity, 30-μm-high contact resistivity 5-mΩ · cm 2 lumped series resistance: neglected electrical properties bulk 2-Ω · cm p-type mc mid-gap SRH lifetimes τ n = τ p = 75 μs front n + diffusion lumped inputs sheet resistance 75 Ω (70-90) recombination parameter J 0 passivated: 201 fA/cm 2 (150-300) contacted: 204 fA/cm 2 (200-600) depth 0.39 μm collection efficiency 0.85 (0.8-0.9). detailed inputs doping profile total and active concentration from [38], see Appendix B surface SRH passivated: S p = 6.63 × 10 6 cm/s, S n = 1 × 10 7 cm/s (derived from [39] with texture multiplier of 1.73) contacted: S p = S n = 1 × 10 7 cm/s (thermal velocity) volume SRH modeled via inactive phosphorus profile according to [39] and a texture multiplier of 1.73 rear p + region lumped inputs sheet resistance 30 Ω (20-40) recombination parameter J 0 = 517 fA/cm 2 (300-700) depth 7-μm collection efficiency 0.7 detailed inputs doping profile measured active concentration from [40] with incomplete ionization model from [45], see Appendix B surface SRH S p = S n = 1 × 10 7 cm/s (thermal velocity) volume SRH modeled as in [41] with parameters in [42] narrowing. J 0 values derived with a different assumption of n ieff are scaled according to J 0 /n ieff 2 = const [22].…”
Section: General Input Parametersmentioning
confidence: 99%
“…(a) 0 measurements (red crosses) as a function of POCl 3 flow during the diffusion process, from Ref [30] and later reevaluated in Ref. [29].…”
Section: Figmentioning
confidence: 99%
“…While there are many demands on a phosphorus diffusion profile designed for a high-performance emitter [3], such as achieving a low emitter saturation current, high V oc , and good blue response, iron typically dominates the minoritycharge carrier lifetime in the bulk in p-type mc-Si [4]. Current PDG of contaminated mc-Si solar cell materials generally fails to remove significant amounts of precipitated iron [5] and produces material with minority-carrier lifetimes that do not approach that of phosphorus-diffused monocrystalline wafers [6].…”
mentioning
confidence: 99%