Reflow Optimization Process: Thermal Stress Using Numerical Analysis and Intermetallic Spallation in Backwards Compatibility Solder Joints

Ani, F. Che; Jalar, Azman; Ismail, Roslina; Othman, Norinsan Kamil; Abdullah, M. Z.; Aziz, M. S. Abdul; Khor, C. Y.; Bakar, Maria Abu

doi:10.1007/s13369-015-1653-6

Cited by 9 publications

(1 citation statement)

References 23 publications

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“…There have been no reports that the spalling of an intermetallic layer disturbs the reliability of solder joints, this is in the attention of the electronics industry. For example, the aerospace products by Aerospace Technical Development Group are still shipped to their customers when they permitted that spalls be used in their products; however, there were no dependability problems reported (Ani et al, 2015). In addition, the morphology of Cu 6 Sn 5 intermetallic layer grains in Figure 13(a), (b), (c) and (d) are not stable along the nano reinforced lead-free solder/Cu joint boundaries because of the unstable allocation of Cu atoms in the joints.…”

Section: Microstructure Investigation In the Ultra-fine Solder Jointmentioning

confidence: 99%

Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

Ani

Jalar²,

Saad

et al. 2019

SSMT

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Purpose This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package. Design/methodology/approach Lead-free Sn-Ag-Cu (SAC) solder paste was mixed with various percentages of NiO nanoparticles to prepare the new form of nano-reinforced solder paste. The solder paste was applied to assemble the ultra-fine capacitor using the reflow soldering process. A focussed ion beam, high resolution transmission electron microscopy system equipped with energy dispersive X-ray spectroscopy (EDS) was used in this study. In addition, X-ray inspection system, field emission scanning electron microscopy coupled with EDS, X-ray photoelectron spectroscopy (XPS) and nanoindenter were used to analyse the solder void, microstructure, hardness and fillet height of the solder joint. Findings The experimental results revealed that the highest fillet height was obtained with the content of 0.01 Wt.% of nano-reinforced NiO, which fulfilled the reliability requirements of the international IPC standard. However, the presence of the NiO in the lead-free solder paste only slightly influenced the changes of the intermetallic layer with the increment of weighted percentage. Moreover, the simulation method was applied to observe the distribution of NiO nanoparticles in the solder joint. Originality/value The findings are expected to provide a profound understanding of nano-reinforced solder joint’s characteristics of the ultra-fine package.

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Section: Microstructure Investigation In the Ultra-fine Solder Jointmentioning

confidence: 99%

Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

Ani

Jalar²,

Saad

et al. 2019

SSMT

View full text Add to dashboard Cite

show abstract

Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component

Zain¹,

Ani²,

Ramli³

et al. 2021

Advances in Robotics, Automation and Data Analytics

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Effect of Potting Encapsulation on Crack Formation and Propagation in Electronic Package

Jalar

Zain

Ani³

et al. 2021

Advances in Robotics, Automation and Data Analytics

View full text Add to dashboard Cite

Reflow Optimization Process: Thermal Stress Using Numerical Analysis and Intermetallic Spallation in Backwards Compatibility Solder Joints

Cited by 9 publications

References 23 publications

Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component

Effect of Potting Encapsulation on Crack Formation and Propagation in Electronic Package

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