Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

Abstract

Purpose This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package. Design/methodology/approach Lead-free Sn-Ag-Cu (SAC) solder paste was mixed with various percentages of NiO nanoparticles to prepare the new form of nano-reinforced solder paste. The solder paste was applied to assemble the ultra-fine capacitor using the reflow soldering process. A focussed ion beam, high resolution transmission electron microscopy system equipped with energy dispersive X-ray spectroscopy (EDS) was used in this study. In addition, X-ray inspection system, field emission scanning electron microscopy coupled with EDS, X-ray photoelectron spectroscopy (XPS) and nanoindenter were used to analyse the solder void, microstructure, hardness and fillet height of the solder joint. Findings The experimental results revealed that the highest fillet height was obtained with the content of 0.01 Wt.% of nano-reinforced NiO, which fulfilled the reliability requirements of the international IPC standard. However, the presence of the NiO in the lead-free solder paste only slightly influenced the changes of the intermetallic layer with the increment of weighted percentage. Moreover, the simulation method was applied to observe the distribution of NiO nanoparticles in the solder joint. Originality/value The findings are expected to provide a profound understanding of nano-reinforced solder joint’s characteristics of the ultra-fine package.

Evolution of Discrete Semiconductor Copper Wedge Bond in Biased Temperature Humidity Chamber

“…Wafer saw process is then followed by die attach process on a leadframe thru the formation of conductive eutectic alloy to enable contact to the substrate, which is an active terminal for the device. Die attach process may also be performed by other means, depending on the requirement of end products [15]. For example, solder attach is typically found in power packages to efficiently handle big current, while logic gate devices on the other hand used non-conductive epoxy since the substrate is not an active terminal.…”

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

“…Lead-free solders have good mechanical and wettability properties, making them sound alternatives for electronics applications for lead-based solders, which exhibit adverse environmental challenges. Despite their comparative advantages, lead-free solders face reliability concerns, including mechanical and thermal fatigue (Che Ani et al , 2019; Zhang et al , 2010). Studies by many researchers in the past decade have shown that the microstructural contents of lead-free solders determine their plastic and creep behaviour during the thermal cycling process (Lin and Chu, 2005; Wiese and Wolter, 2007).…”

Investigating the impact of different solder alloy materials during laser soldering process

“…Numerous research papers have explored methods and parameters to enhance the quality and reliability of solder joints in reflow processes (Bachok et al, 2018;Che Ani et al, 2018a, 2018b, 2019Mohamed Muzni et al, 2023;Zhang et al, 2023). However, a noticeable gap exists in the optimization of laser soldering parameters.…”