Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component

Zain, Syed Mohamad Mardzukey Syed Mohamed; Ani, F. Che; Ramli, Mohamad Riduwan; Jalar, Azman; Bakar, Maria Abu

doi:10.1007/978-3-030-70917-4_29

Cited by 5 publications

(1 citation statement)

References 10 publications

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“…Moisture is absorbed into the termination structure due to the porosity of the base termination, the hygroscopic properties of conductive epoxy and the presence of void between the base metal and conductive epoxy (John Maxwell, 2006;Teverovsky, 2018;Zain et al, 2021). Moisture-induced defects are common failure modes that occur during the reflow process such as for integrated circuit (IC) packages.…”

Section: Introductionmentioning

confidence: 99%

Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process

Bachok,

Abas,

Raja Gobal

et al. 2023

SSMT

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Purpose This study aims to investigate crack propagation in a moisture-preconditioned soft-termination multi-layer ceramic capacitor (MLCC) during thermal reflow process. Design/methodology/approach Experimental and extended finite element method (X-FEM) numerical analyses were used to analyse the soft-termination MLCC during thermal reflow. A cross-sectional field emission scanning electron microscope image of an actual MLCC’s crack was used to validate the accuracy of the simulation results generated in the study. Findings At 270°C, micro-voids between the copper-electrode and copper-epoxy layers absorbed 284.2 mm/mg3 of moisture, which generated 6.29 MPa of vapour pressure and caused a crack to propagate. Moisture that rapidly vaporises during reflow can cause stresses that exceed the adhesive/substrate interface’s adhesion strength of 6 MPa. Higher vapour pressure reduces crack development resistance. Thus, the maximum crack propagation between the copper-electrode and copper-epoxy layers at high reflow temperature was 0.077 mm. The numerical model was well-validated, as the maximum crack propagation discrepancy was 2.6%. Practical implications This research holds significant implications for the industry by providing valuable insights into the moisture-induced crack propagation mechanisms in soft-termination MLCCs during the reflow process. The findings can be used to optimise the design, manufacturing and assembly processes, ultimately leading to enhanced product quality, improved performance and increased reliability in various electronic applications. Moreover, while the study focused on a specific type of soft-termination MLCC in the reflow process, the methodologies and principles used in this research can be extended to other types of MLCC packages. The fundamental understanding gained from this study can be extrapolated to similar structures, enabling manufacturers to implement effective strategies for crack reduction across a wider range of MLCC applications. Originality/value The moisture-induced crack propagation in the soft-termination MLCC during thermal reflow process has not been reported to date. X-FEM numerical analysis on crack propagation have never been researched on the soft-termination MLCC.

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Section: Introductionmentioning

confidence: 99%