2006
DOI: 10.1016/j.tsf.2006.05.024
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Reflectance and photoluminescence spectra of as grown and hydrogen and nitrogen incorporated tetrahedral amorphous carbon films deposited using an S bend filtered cathodic vacuum arc process

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Cited by 26 publications
(31 citation statements)
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“…The details about the FCVA system and the other deposition conditions have been described earlier. [25][26][27][28] During the deposition of ta-C:H and ta-C:N films, the substrate bias was kept constant at Ϫ300 V and the arc current ͑ϳ75 A͒ and magnetic field ͑ϳ350 G͒ in the S-bend duct were also kept constant. The thickness of the films is found to be in the range of 500Ϯ 100 Å as measured by a Talystep ͑Rank Taylor and Hobson͒ thickness profiler.…”
Section: Methodsmentioning
confidence: 99%
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“…The details about the FCVA system and the other deposition conditions have been described earlier. [25][26][27][28] During the deposition of ta-C:H and ta-C:N films, the substrate bias was kept constant at Ϫ300 V and the arc current ͑ϳ75 A͒ and magnetic field ͑ϳ350 G͒ in the S-bend duct were also kept constant. The thickness of the films is found to be in the range of 500Ϯ 100 Å as measured by a Talystep ͑Rank Taylor and Hobson͒ thickness profiler.…”
Section: Methodsmentioning
confidence: 99%
“…The properties investigated are also system dependent. 2 One of the first systematic reports of ta-C films at high substrate bias ͑Ϫ300 V͒ of reflectance and photoluminescence, 25 x-ray photoelectron spectroscopy ͑XPS͒, x-ray Auger induced electron spectroscopy ͑XAES͒, and Raman spectroscopy studies, 26 plasma diagnostic studies 27 and electrical and mechanical properties 28 have been published recently. The current work complements it, especially with reference to the possibility of use of this material as electronic material by studying the defect density measured using space-charge-limited-conduction ͑SCLC͒ studies and the field assisted electron emission of as-grown ta-C, ta-C:H, and ta-C:N films.…”
Section: Introductionmentioning
confidence: 99%
“…The presence of NH 3 and O 2 during Table 2. Blue photoluminescence bands, on top of the broad continua (top two entries in italic) in laboratory ta-C:H (a-C:H materials rich in diamond-like or tetrahedral sp 3 C atom bonding) at 80 K, excited by 300 nm photons (Panwar et al 2006) and in the Red Rectangle HD 44179 (Vijh et al 2004(Vijh et al , 2005c Notes. The most prominent sharp bands in the ta-C:H and ta-C:N laboratory data are marked in boldface.…”
Section: N-dopingmentioning
confidence: 99%
“…One of the main advantages of FCVA process is a high growth rate process where no hazardous gases like SiH 4 , B 2 H 6 and PH 3 are used to deposit doped silicon films. FCVA is plasma based popular industrial technology for the deposition of variety of films like metals, ceramics, diamondlike carbon and tetrahedral amorphous carbon films [11][12][13][14][15][16][17]. It is a low voltage and high current process that takes place between two electrodes.…”
Section: Introductionmentioning
confidence: 99%
“…EXPERIMENTAL DETAILS P doped Si: H thin films have been prepared by FCVA technique. A detailed description of the system has been described elsewhere [17]. The FCVA process works on the principle of striking the arc (arc voltage of 35-40 V with an arc current of 100 A) between two electrodes.…”
Section: Introductionmentioning
confidence: 99%