Abstract:P-channel MOS transistors with raised Si 1 Ge and Si source/drain (S/D) structure selectively grown by ultra high vacuum chemical vapor deposition (UHVCVD) were fabricated for the first time. The impacts of Si 1 Ge and Si epitaxial S/D layer on S/D series resistance and drain current of p-channel transistors were studied. Our result show that the new device with Si 1 Ge raised S/D layer depicts only half the value of the specific contact resistivity and S/D series resistance ( SD ), compared to the device with… Show more
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