We have extensively studied the impact of advanced annealing schemes for highperformance
SOI logic technologies. Starting with the 130 nm technology node, we introduced
spike rapid thermal annealing (sRTA). Continuous temperature reduction combined with implant
scaling helped to improve transistor performance and short channel behavior. During the
development of the 90 nm technology we evaluated flash lamp and laser annealing (FLA). These
techniques became an essential part of the 65 nm node. At this node we also faced major challenges
in terms of compatibility with new materials like SiGe as well as the need for reduction of process
parameter fluctuations. Scaling will be continued with the 45 nm technology node towards a truly
diffusionless process.