2000
DOI: 10.1016/s0169-4332(99)00482-1
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Recent progress in thin film growth analysis by multichannel spectroscopic ellipsometry

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Cited by 49 publications
(35 citation statements)
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“…A variety of optical characterization methods such as reflectance and transmittance measurements [44], Fourier transform infrared spectroscopy (FTIR) [45], spectroscopic ellipsometry (SE) [46][47][48][49][50], and electron energy loss spectroscopy (EELS) [51] have been applied to the identification of the microstructure giving rise to the various optical and electronic properties. Among several state-of-the art techniques for optical characterization, spectroscopic ellipsometry (SE) proved to be very influential and advantageous for the last two decades in the semiconductor thin film process control and structural analysis, in general and for amorphous silicon thin films in particular [4,48,[52][53][54][55][56][57][58][59][60].…”
Section: Introductionmentioning
confidence: 99%
“…A variety of optical characterization methods such as reflectance and transmittance measurements [44], Fourier transform infrared spectroscopy (FTIR) [45], spectroscopic ellipsometry (SE) [46][47][48][49][50], and electron energy loss spectroscopy (EELS) [51] have been applied to the identification of the microstructure giving rise to the various optical and electronic properties. Among several state-of-the art techniques for optical characterization, spectroscopic ellipsometry (SE) proved to be very influential and advantageous for the last two decades in the semiconductor thin film process control and structural analysis, in general and for amorphous silicon thin films in particular [4,48,[52][53][54][55][56][57][58][59][60].…”
Section: Introductionmentioning
confidence: 99%
“…The accuracy of measurements can be enhanced by employing spectroscopic ellipsometers with a wide range of wavelengths [18][19][20]. For our single wavelength setup, systematic errors may yet be reduced by design optimization and changes in optical instruments as shown in the other system [18].…”
Section: Resultsmentioning
confidence: 99%
“…The distortions are caused by a presence of surface layer (SL) associated with the mechanical polishing process [15,16] the case of the layer thicknesses, here the subscripts correspond to the sequence numbers of layers and, in particular, the upper layer (the air) is denoted by the subscript 'zero'). Using the ellipsometric data obtained for the implanted surface in the two orthogonal incidence planes and the calculation procedure described above (see Eqs.…”
Section: Methodsmentioning
confidence: 99%