2004
DOI: 10.1016/j.jnoncrysol.2004.07.008
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Role of H in hot-wire deposited a-Si:H films revisited: optical characterization and modeling

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Cited by 13 publications
(4 citation statements)
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“…XRD results are shown in Fig. 5b, showing also the peak assignment [29,30] -compare to Fig. 5a, and once again confirming that diamond was obtained.…”
Section: Hfcvd Synthesis Of Dtf From a Mixture Of Paraffinssupporting
confidence: 79%
See 1 more Smart Citation
“…XRD results are shown in Fig. 5b, showing also the peak assignment [29,30] -compare to Fig. 5a, and once again confirming that diamond was obtained.…”
Section: Hfcvd Synthesis Of Dtf From a Mixture Of Paraffinssupporting
confidence: 79%
“…Their complex composition, however, may be detrimental in such applications as microelectronics. A variety of additional methods of DTF deposition on surfaces of different chemical nature have also been reported earlier [22][23][24][25][26][27][28][29][30][31][32][33][34].…”
Section: Introductionmentioning
confidence: 99%
“…These films deposited under a pressure of 120 mTorr with a 5 cm wire to substrate spacing and 300 nm thickness, have an rms roughness and lateral correlation length which generally increase with substrate temperature at each dilution. This is in contrast to results for both crystalline and amorphous Si seen by molecular beam epitaxy [7] and plasmaenhanced CVD (PECVD) [8] and is more akin to the increase in surface roughness with increasing substrate temperature seen in HWCVD grown amorphous silicon [9]. If we assume that the H coverage prevents contaminants such as C and O from depositing onto the surface, but does allow Si to deposit, then at higher substrate temperatures increased hydrogen desorption leads to higher contaminant incorporation [2,10], which would increase the surface roughness with increasing substrate temperature [10][11][12].…”
Section: Surface Roughness and Evolutioncontrasting
confidence: 78%
“…This is in contrast to results for both crystalline and amorphous Si seen by molecular beam epitaxy 20 and plasma-enhanced CVD ͑PECVD͒ 2 and is more akin to the increase in surface roughness with increasing substrate temperature seen in HWCVD grown amorphous silicon. 28 If we assume as in Mason 7 and Richardson et al 17 that H coverage prevents contaminants, such as C and O, from depositing onto the surface, but does allow Si to deposit, then at higher substrate temperatures increased hydrogen desorption leads to higher contaminant incorporation, which would increase the surface roughness with increasing substrate temperature. 13,17,29 Moreover, given that the H coverage of the Si͑100͒ surface at high H dilutions is large and temperature independent below 300°C, 30 then as we lower the substrate temperature from 270°C to 230°C, we suggest that film growth becomes surface mobility limited and there is an increase in the film roughness once more.…”
Section: A Thin Film Structure and Crystallinitymentioning
confidence: 96%