Realization of a SiC module-based indirect matrix converter with minimum parasitic inductances

Hayes, Jonathan; Escobar-Mejía, Andrés; Balda, Juan Carlos; Dutta, Atanu; Ang, Simon S.

doi:10.1109/apec.2014.6803368

Cited by 6 publications

(5 citation statements)

References 21 publications

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“…Sci. 2021, 11,9366 The manufactured power board on the IMS with all power semicond bled can be seen in Figure 19 at the left image. The top three spacers are used for input phases.…”

Section: Discussionmentioning

confidence: 99%

“…Sci. 2021, 11,9366 The power and driver board are stackable with one another. The signa are made through pin headers.…”

Section: Structure Of the Modulementioning

confidence: 99%

“…non-standard manufacturing technology must be used, which can be costly These publications show the effort of the researchers to build a compact sample of the bidirectional switch for the matrix converter [10], where authors build an intelligent power switch module with implemented commutation in the module (since every module consists of a microcontroller in which the commutation algorithm is implemented). The next publications show a sample of the low parasitic inductance module based on the SiC chips from the CREE manufacturer [11,12]. The disadvantage of these modules is that if one device is destroyed, the whole module becomes useless, or the replacement of the broken component can be very expensive.…”

Section: Introductionmentioning

confidence: 99%

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Compact 3 × 1 Matrix Converter Module Based on the SiC Devices with Easy Expandability

Resutik

Kascak

2021

Applied Sciences

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This paper discusses a new approach for building a compact all-in-one matrix converter module based on SiC semiconductors arranged in a common source connection. The used transistors are in the D2PAK package. The design of the module is divided into two parts, namely a power module designed at one-layer aluminum substrate printed circuit board (PCB) to ensure good thermal performance and voltage isolation between the module and heatsink. The second board is responsible for the SiC driving and is mounted at the top of the power PCB and consists of metal-oxide semiconductor field effect transistor (MOSFET) drivers, isolated power supplies, a current direction detection circuit, and current value sensors. In the paper, the proper function of the SiC MOSFET drivers, current direction detection, and current measurement sensors were evaluated. Finally, 3D design together with the final prototype is presented. The modules contain three bidirectional cells for interconnection three input voltage sources and one output phase. The uniqueness and novelty of the presented module are the compactness and easy expandability of the module to achieve higher power outputs and multiphase applications such as five phase machines.

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“…Sci. 2021, 11,9366 The manufactured power board on the IMS with all power semicond bled can be seen in Figure 19 at the left image. The top three spacers are used for input phases.…”

Section: Discussionmentioning

confidence: 99%

“…Sci. 2021, 11,9366 The power and driver board are stackable with one another. The signa are made through pin headers.…”

Section: Structure Of the Modulementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Compact 3 × 1 Matrix Converter Module Based on the SiC Devices with Easy Expandability

Resutik

Kascak

2021

Applied Sciences

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“…Another challenge of the circuit-electromagnetic modeling approach is to specify the frequency of interest for which an equivalent lumped circuit is generated, for example, the switching frequency is used in [7], and the critical frequency associated to the device fall time in [8]. During the switching transients of SiC devices, the interconnects and the external conductors of the power module conduct the current pulses with very fast rise/fall time, t r /t f , of approximately 10 ns to 50 ns.…”

Section: B Circuit-electromagnetic Coupled Modelingmentioning

confidence: 99%

Highly accurate virtual dynamic characterization of discrete SiC power devices

Kovacevic-Badstuebner

Ziemann

Kakarla

et al. 2017

2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)

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Optimized low-inductive layouting of the package interconnections and external PCBs and bus-bars are necessary to benefit from Silicon Carbide (SiC) power devices, which allow inherently very fast switching transitions. In this paper, a comprehensive modeling procedure for highly accurate virtual dynamic characterization of discrete SiC power devices is described taking into account the 3D geometry of the internal and external interconnections of package as input. The modeling requirements are discussed on an example of a commercial 1.2 kV, 80 mΩ SiC Power MOSFET in a standard TO-247 package (Cree C2M0080120D). The software tools, Simplorer, Saber, Q3D and LTSpice, commonly used for modeling and simulation of power modules, are evaluated with respect to their modeling capabilities for SiC devices.

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“…A DSP is often sufficient for controlling a power electronic prototype [3]. The DSP is required to accomplish its tasks in a sequential order within a specific period of time.…”

Section: Introductionmentioning

confidence: 99%

750-kW interleaved buck converter dc supply control implementation in a low-cost FPGA

Liu

Farnell

Ahmed

et al. 2015

2015 IEEE Applied Power Electronics Conference and Exposition (APEC)

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The digital control of a 750-kW dc supply that converts a 480-V three-phase ac input voltage to an adjustable dc output voltage which has the maximum voltage value of 600 V is presented in this paper. Digital control is important for achieving precise data acquisition and proper operation of power electronic equipment. In addition to power semiconductor switching signals, several fault and warning signals from the power converter must be considered. Providing sufficient inputs/outputs (I/Os) and high-speed parallel processing, the fieldprogrammable gate array (FPGA) is one of the best candidates to accomplish the tasks mentioned above. In the proposed FPGA application, all functions including analog-to-digital conversion (ADC), power electronic converter algorithms, data interface, and protection logic for the dc supply are implemented in one single cheap FPGA which operates at a 25 MHz clock. All programming of the FPGA is completed by manual coding of hardware description language -the Very high speed integrated circuit Hardware Description Language (VHDL). A small-scale prototype is built and tested to provide further verification of the VHDL code prior to final implementation of the 750-kW prototype. The validity of control algorithms and FPGA functions are verified by simulations using Matlab/Simulink TM Xilinx ISE TM , respectively, prior to implementation in the hardware prototype. Keywords-interleaved dc converter; field-programmable gate array (FPGA); high powerThis project is supported by NSF I/UCRC GRid-connected Advanced Power Electronic Systems (GRAPES).

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Realization of a SiC module-based indirect matrix converter with minimum parasitic inductances

Cited by 6 publications

References 21 publications

Compact 3 × 1 Matrix Converter Module Based on the SiC Devices with Easy Expandability

Compact 3 × 1 Matrix Converter Module Based on the SiC Devices with Easy Expandability

Highly accurate virtual dynamic characterization of discrete SiC power devices

750-kW interleaved buck converter dc supply control implementation in a low-cost FPGA

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