2012
DOI: 10.1016/j.mee.2011.10.014
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Realization of 850V breakdown voltage LDMOS on Simbond SOI

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Cited by 19 publications
(6 citation statements)
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“…Step Doping (LSD) techniques [5]- [13]. However, due to the limitation of actual process or the requirement of design, the vertical doping profile can hardly be uniform.…”
Section: Introductionmentioning
confidence: 99%
“…Step Doping (LSD) techniques [5]- [13]. However, due to the limitation of actual process or the requirement of design, the vertical doping profile can hardly be uniform.…”
Section: Introductionmentioning
confidence: 99%
“…However, it can be concluded that these structures still suffer the premature breakdown because of the high electric field at the end of the drift region. A few methods for modulating the surface electric field have been delivered in SJ LDMOS such as the buffer layer [21], the buried layer [22], the variable lateral doping [23], the variable lateral thickness [24], and so on . However, more masks would be required to fabricate, the process complexity and fabrication cost would increase.…”
Section: Introductionmentioning
confidence: 99%
“…The Variation of Lateral doping (VLD) technique is an effective method to achieve an ideal uniform lateral electric field. [6] In our previous study, the Variation of Lateral Thickness (VLT) technique is proposed to uniformize the lateral electric field and maximize the lateral BV. [7] The Variation of Lateral Width technique together with the high-k dielectric (VLWHK) is also employed to improve the issue [8] .…”
Section: Introductionmentioning
confidence: 99%