Pr1–x
Ca
x
MnO3 (PCMO)-based
resistance random access memory
(RRAM) is attractive in large-scale memory and neuromorphic applications
as it is nonfilamentary and area scalable and has multiple resistance
states along with excellent endurance and retention. The PCMO RRAM
exhibits area-scalable resistive switching when in contact with the
reactive electrode. The interface redox reaction-based resistance
switching is observed electrically. Yet, whether the resistance change
occurs near the reactive interface or spread over the entire bulk
is largely debated. Essentially, a two-terminal device is unable to
provide direct evidence of the resistance change region in the PCMO
RRAM. In this paper, we propose and experimentally demonstrate a three-terminal
RRAM (3T-RRAM) device in which a thin third terminal (∼20 nm)
is inserted laterally in close proximity to a typical vertical two-terminal
RRAM device of PCMO thickness ∼80 nm. It is well known that
the reactive interface participates in the resistive switching. However,
using the 3T-RRAM, we demonstrate that the resistance change also
occurs in the region near the inert electrode. We further show that
the resistance measured by T3 is exclusively sensitive to the region
near the inert electrode as opposed to the reactive electrode. Finally,
the highly symmetric space charge limited current (SCLC) characteristics
with polarity at various resistance levels, typical of two-terminal
RRAM, are undisturbed because of the slightly adjacent placement of
the nanoscale inert third terminal while providing resistance change
read sensitivity. It is the first time that an interface redox and
bulk SCLC-based resistance change has been experimentally shown as
correlated and consistent, enabled by the third terminal of the RRAM.
Such a study details a critical understanding of the device which
can enable the design and development of PCMO RRAM for large memory
and neuromorphic computing applications.