Atomic layer deposition (ALD) is
a powerful nanofabrication technique
for the preparation of uniform, conformal, and ultrathin films and
allows accurate control of the composition and thickness of thin films
at the atomic level. To date, ALD has been used for the growth of
various materials, including oxides, nitrides, sulfides, metals, elements,
compound semiconductors, and organic and organic–inorganic
hybrid materials. As one of the most important inorganic materials,
silicon dioxide (SiO2) has been used in the fields of microelectronics,
catalysis, and energy storage and conversion. Various SiO2 ALD methods have been developed, which have expanded the research
and applications of ALD chemistry and technology. Recent advances
concerning the reaction mechanisms of SiO2 ALD have further
deepened our understanding of the surface chemistry and related catalysis
in the ALD of SiO2 and other oxides. Thin films of SiO2 can be obtained by means of thermal ALD and energy-enhanced
ALD. Thermal ALD of SiO2 includes H2O-based
ALD without a catalyst, room-temperature ALD (RT-ALD) catalyzed by
a Lewis base, and rapid ALD (RALD) catalyzed by a Lewis acid. Energy-enhanced
ALD of SiO2 encompasses plasma-enhanced ALD and O3-based ALD using aminosilane. In this review, we highlight the significance
and advantages of ALD and introduce many methods of SiO2 ALD. Subsequently, theoretical advances concerning reaction mechanisms
of SiO2 ALD are summarized. The related catalysis phenomena
are highlighted, and their possible applications are speculated upon.
Finally, a conclusion and perspective on the catalysis in the ALD
growth of SiO2 is provided. It is expected that theoretical
research on SiO2 ALD will enhance our comprehension of
the chemistry and catalysis pertaining to ALD, provide a guide for
the design of more effective Si precursors for SiO2 ALD,
and lead to further improvement in the ALD preparation of other oxides
and their nanolaminates.