Rapid and Versatile Photonic Annealing of Graphene Inks for Flexible Printed Electronics

Secor, Ethan B.; Ahn, Byung Yoon; Gao, Theodore Z.; Lewis, Jennifer A.; Hersam, Mark C.

doi:10.1002/adma.201502866

Cited by 276 publications

(316 citation statements)

References 42 publications

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“…Secor and co-workers proposed a graphene ink-nitrocellulose electrochemical sensor for H 2 O 2 determination [33]. Several works have demonstrated that a post treatment of the graphene ink could improve its conductivity through thermal reduction process [12,34,35]. More specifically, Arapov et al [12], Secor et al [34], and Del et al [35] enhanced graphene ink films to sheet resistances of 1.4 Ω/cm, 21.4 Ω/cm, and 30 kΩ/cm, respectively.…”

Section: Introductionmentioning

confidence: 99%

Graphene Ink Film Based Electrochemical Detector for Paracetamol Analysis

Xie

Zheng

et al. 2018

Electronics

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Graphene ink is a commercialized product in the graphene industry with promising potential application in electronic device design. However, the limitation of the graphene ink is its low electronic performance due to the ink preparation protocol. In this work, we proposed a simple post-treatment of graphene ink coating via electrochemical oxidation. The electronic conductivity of the graphene ink coating was enhanced as expected after the treatment. The proposed electrochemical oxidation treatment also exposes the defects of graphene and triggered an electrocatalytic reaction during the sensing of paracetamol (PA). The overpotential of redox is much lower than conventional PA redox potential, which is favorable for avoiding the interference species. Under optimum conditions, the graphene ink-based electrochemical sensor could linearly detect PA from 10 to 500 micro molar (µM), with a limit of detection of 2.7 µM.

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Section: Introductionmentioning

confidence: 99%

Graphene Ink Film Based Electrochemical Detector for Paracetamol Analysis

Xie

Zheng

et al. 2018

Electronics

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“…In order to achieve high σ, a sintering step is necessary, which typically requires temperatures above that of the dielectric glass transition temperature (T g ) of the dielectric substrate. Surface-sensitive sintering techniques based on photonics have recently become popular in order to circumvent this challenge [23]. Since this type of sintering evolves under nonequilibrium conditions across multiple scales there are not well known, processstructure-property relationships must be developed.…”

Section: Challenges Aheadmentioning

confidence: 99%

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

Rosker

Sandhu

Hester

et al. 2018

International Journal of Antennas and Propagation

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Printing methods such as additive manufacturing (AM) and direct writing (DW) for radio frequency (RF) components including antennas, filters, transmission lines, and interconnects have recently garnered much attention due to the ease of use, efficiency, and low-cost benefits of the AM/DW tools readily available. The quality and performance of these printed components often do not align with their simulated counterparts due to losses associated with the base materials, surface roughness, and print resolution. These drawbacks preclude the community from realizing printed low loss RF components comparable to those fabricated with traditional subtractive manufacturing techniques. This review discusses the challenges facing low loss RF components, which has mostly been material limited by the robustness of the metal and the availability of AM-compatible dielectrics. We summarize the effective printing methods, review ink formulation, and the postprint processing steps necessary for targeted RF properties. We then detail the structure-property relationships critical to obtaining enhanced conductivities necessary for printed RF passive components. Finally, we give examples of demonstrations for various types of printed RF components and provide an outlook on future areas of research that will require multidisciplinary teams from chemists to RF system designers to fully realize the potential for printed RF components.

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“…These methods include Joule heating, [31] microwave irradiation, [12] infra-red heating, [32] and photonic flash annealing. [6,[33][34][35] The latter is a contactless, highly controllable method compatible with highspeed R2R processing and, since it is based on the light absorption, holds great promise for graphene applications.…”

Section: Introductionmentioning

confidence: 99%

Conductivity Enhancement of Binder‐Based Graphene Inks by Photonic Annealing and Subsequent Compression Rolling

et al. 2016

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This paper describes a combination of photonic annealing and compression rolling to improve the conductive properties of printed binder‐based graphene inks. High‐density light pulses result in temperatures up to 500 °C that along with a decrease of resistivity lead to layer expansion. The structural integrity of the printed layers is restored using compression rolling resulting in smooth, dense, and highly conductive graphene films. The layers exhibit a sheet resistance of less than 1.4 Ω □−1 normalized to 25 µm thickness. The proposed approach can potentially be used in a roll‐to‐roll manner with common substrates, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and paper, paving thereby the road toward high‐volume graphene‐printed electronics.

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Rapid and Versatile Photonic Annealing of Graphene Inks for Flexible Printed Electronics

Cited by 276 publications

References 42 publications

Graphene Ink Film Based Electrochemical Detector for Paracetamol Analysis

Graphene Ink Film Based Electrochemical Detector for Paracetamol Analysis

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

Conductivity Enhancement of Binder‐Based Graphene Inks by Photonic Annealing and Subsequent Compression Rolling

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