2000
DOI: 10.1116/1.591371
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Radio frequency plasma annealing of positive charge generated by Fowler–Nordheim electron injection in buried oxides in silicon

Abstract: Articles you may be interested inMechanisms of positive charge generation in buried oxide of UNIBOND and separation by implanted oxygen silicon-on-insulator structures during high-field electron injection

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Cited by 17 publications
(15 citation statements)
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References 37 publications
(23 reference statements)
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“…Nowadays the radio-frequency (RF) plasma treatment is broadly utilized to improve characteristics of MOS devices [1][2][3][4][5][6][7][8][9][10][11]. One of its advantages is a possibility to use it in the final stage of manufacturing of integrated circuits after the metallization formation.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Nowadays the radio-frequency (RF) plasma treatment is broadly utilized to improve characteristics of MOS devices [1][2][3][4][5][6][7][8][9][10][11]. One of its advantages is a possibility to use it in the final stage of manufacturing of integrated circuits after the metallization formation.…”
Section: Introductionmentioning
confidence: 99%
“…One of its advantages is a possibility to use it in the final stage of manufacturing of integrated circuits after the metallization formation. Papers [2][3][4][5][6][7][8][9] demonstrate that the radio-frequency plasma treatment allows to obtain both thermal annealing of the MOS device and non-thermal processes of neutralization, as well as annealing of charge in the dielectric and at the interface. As a result, at the RF plasma treatment, a reconstruction of silicon dioxide and Si/SiO 2 interface can take place.…”
Section: Introductionmentioning
confidence: 99%
“…RF treatment with the power 1:5 W cm −2 and additional heating the sample up to 200 • C for 30 min was performed. These conditions of power and additional heating correspond to a sample temperature of about 300 • C [1]. This temperature was chosen to avoid QD growth.…”
Section: Methodsmentioning
confidence: 99%
“…The hydrogen RF plasma treatment is widely used to anneal e ectively the deep levels in the forbidden band of the near-surface Si layers in Si-SiO 2 structures implanted by small ion doses (D ¡ 10 14 cm −2 ) [1,2]. The temperatures do usually not exceed some 400 • C in these treatments with the e ciency of deep level annealing being comparable with those after thermal annealing at 700 -750 • C. Such possibility may be very helpful in the case of CdSSe quantum dots embedded into a borosilicate glass matrix that are extensively studied since the pioneering works by Bret [3], Borodulin [4] and Lisitsa [5], particularly because of their potential application in optical devices.…”
Section: Introductionmentioning
confidence: 99%
“…For example, RF plasma processing may cause enhanced defect annealing in the near surface of the silicon substrate [2][3][4][5] as well as at the silicondioxide/silicon (SiO 2 /Si) interface and within the oxide [1,7]. It has recently been shown [8] that such a treatment also leads to efficient removal of the positive charge generated in the buried oxide of SIMOX (separation-by-implanted-oxygen) by strong-field electron injection. Similarly, enhancement of the photoluminescence (PL) intensity over the red portion of the electromagnetic spectrum has been observed in high-dose Si-implanted SiO 2 following plasma processing, and this effect has been attributed to the annealing of defects at the SiO 2 /Si interfaces of the Si nanoclusters embedded within the oxide matrix [9].…”
Section: Introductionmentioning
confidence: 98%