Lateral type n-channel 4H-SiC MOSFETs fabricated by current industrial process are irradiated with gamma-ray at different irradiation doses in this paper, to make a profound study on the generation mechanism of radiation-induced interface traps and oxide trapped charges. Electrical parameters (e.g. threshold voltage, subthreshold swing and channel mobility) of the device before and after irradiation are investigated, and the influence of the channel orientation ([1$\bar 1$00] and [11$\bar 2$0]) on the radiation effect is discussed for the first time. Positive threshold voltage shift is observed at very low irradiation doses (<100 krad(Si)), the threshold voltage then shifts negatively with dose increasing. It is found that the dependence of interface trap generation on radiation dose is not the same for doses below and above 100 krad. For irradiation doses <100 krad, the radiation-induced interface traps with relatively high generation speeds dominate the competition with radiation-induced oxide trapped charges, contributing to the positive threshold voltage shift correspondingly. All these results provide additional insight into the radiation-induced charge trapping mechanism in SiO2/SiC interface.