Material characterization is challenged by continuously decreasing device dimensions placing significant demands on characterization instruments and measurement interpretation. Numerous techniques exist and a few are highlighted here. Some of these have existed for a long time, while others have only emerged from the laboratory recently. Generally they are more user-friendly and have reasonable turn-around times. The trend in many techniques is clearly toward characterization of smaller dimensions. Among the myriad of characterization techniques in use today, I will discuss recent advances in transmission electron microscopy (TEM), electron holography, magnetic exchange force microscopy (MExFM), atom probe ion field ion microscopy, and X-ray tomography. They have made significant advances in the last few years and in some cases have produced very impressive results. For example, TEM is now able to generate images with 0.05 nm resolution, allowing display of individual atoms. MExFM in conjunction with magnetic fields has demonstrated vertical resolution of 0.0015 nm. Helium ion microscopy is also highlighted because it contributes a new application of ion beams, which had been largely the domain of Rutherford backscattering. Progress in developing further advances in nm dimensional characterization will, no doubt, continue to satisfy the demand for such measurements in the future.