PWM Converter Power Density Barriers

Kolar, Johann W.; Drofenik, U.; Biela, J.; Heldwein, Marcelo Lobo; Ertl, H.; Friedli, Thomas; Round, S.D.

doi:10.1541/ieejias.128.468

Cited by 108 publications

(89 citation statements)

References 15 publications

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“…The self-driven method uses directly power transformer to generate the control signals so its implementation is very simple, cheap and it has an advantage where power density/weight is important like electric vehicle and data center applications (Kolar et al, 2008;Zhao et al 2009;Badstuebner et al, 2011& Badstuebner et al, 2010. In this study, auxiliary windings are directly used to drive parallel connected SRs.…”

Section: Self-driven Proceduresmentioning

confidence: 99%

“…Recently, research in the area of power converters area has focused on high power density, due to the advantage of cost reduction, limited space and weight requirements in some application areas like telecom/data center, electric vehicle/aircraft (Kolar et al, 2008). Besides, in data center application, increasing energy consumption due to more energy demand and rising energy price require high efficiency power conversion.…”

Section: Introductionmentioning

confidence: 99%

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Optimization of a self-driven current-doubler phase shifted full bridge DC-DC converter with integrated magnetic

Çetin

2014

J Engin Res

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Section: Self-driven Proceduresmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Optimization of a self-driven current-doubler phase shifted full bridge DC-DC converter with integrated magnetic

Çetin

2014

J Engin Res

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“…1) [1]. The most frequently used figure of merit which brings together all these parameters and provides a reliable assessment of the progress of the technology is power density.…”

Section: Introductionmentioning

confidence: 99%

“…The present-day technology is already facing the barriers which could limit the power density of power electronic converters in future (Fig. 2) [1].…”

Section: Introductionmentioning

confidence: 99%

The world’s first high voltage GaN-on-Diamond power semiconductor devices

Baltynov

Unni

Narayanan

2016

Solid-State Electronics

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“…More in detail, a target is to investigate different materials and thickness values for the heat sink [4] via simulation using PLECS [5] by recording the junction and heat sink temperature. Furthermore, by running an AC sweep, the Bode magnitude plot of the output heat flow is obtained and is another indication of the cooling system effectiveness.…”

Section: Introductionmentioning

confidence: 99%

Heat sink design considerations in medium power electronic applications with long power cycles

Asimakopoulos

Papastergiou

Thiringer

et al. 2015

2015 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe)

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The aim of this work is to investigate the impact of the heat sink thickness and material, as well as, of the convection coefficient of the water cooling system on the power-electronics module thermal stressing. The heat extraction capability of different thicknesses is tested. It is concluded that the thickest heat sink results in marginally lower temperature variation at the junction level compared to the second thickest one. In the thickest heat sink case, the linear dependence of the thermal resistance on the thickness counteracts the benefit of the increased thermal capacitance. The increase in the cooling medium flow rate, which corresponds to an increase in the convection coefficient between the heat sink bottom surface and the water, can be avoided by increasing the thickness of the heat sink. In this way, the energy consumption of the cooling system is reduced. The increase in the flow rate drastically reduces the thermal stressing in the thinnest heat sink case. The increase of the heat sink thickness can be beneficial for long power cycles. Copper and aluminum are the two materials that are compared, with the copper heat sink exhibiting a slightly increased performance. The study is conducted for a medium power DC-DC converter of a magnet supply with focus on long power cycles.Presented at: EPE 2015, 7-10 September 2015, Geneva, Switzerland Geneva, Switzerland October, 2015 Heat sink design considerations in medium power electronic applications with long power cycles AbstractThe aim of this work is to investigate the impact of the heat sink thickness and material, as well as, of the convection coefficient of the water cooling system on the power-electronics module thermal stressing. The heat extraction capability of different thicknesses is tested. It is concluded that the thickest heat sink results in marginally lower temperature variation at the junction level compared to the second thickest one. In the thickest heat sink case, the linear dependence of the thermal resistance on the thickness counteracts the benefit of the increased thermal capacitance. The increase in the cooling medium flow rate, which corresponds to an increase in the convection coefficient between the heat sink bottom surface and the water, can be avoided by increasing the thickness of the heat sink. In this way, the energy consumption of the cooling system is reduced. The increase in the flow rate drastically reduces the thermal stressing in the thinnest heat sink case. The increase of the heat sink thickness can be beneficial for long power cycles. Copper and aluminum are the two materials that are compared, with the copper heat sink exhibiting a slightly increased performance. The study is conducted for a medium power DC-DC converter of a magnet supply with focus on long power cycles.

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PWM Converter Power Density Barriers

Cited by 108 publications

References 15 publications

Optimization of a self-driven current-doubler phase shifted full bridge DC-DC converter with integrated magnetic

Optimization of a self-driven current-doubler phase shifted full bridge DC-DC converter with integrated magnetic

The world’s first high voltage GaN-on-Diamond power semiconductor devices

Heat sink design considerations in medium power electronic applications with long power cycles

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