As scaling becomes increasingly difficult, 3D integration has emerged as a viable alternative to achieve the requisite bandwidth and power efficiency challenges. However mechanical stress induced by the through silicon vias (TSV) is one of the key constraints in the 3D flow that must be controlled in order to preserve the integrity of front end devices. For the first time an extended and comprehensive study is given for the stress induced by single-and arrayed TSVs and its impact on both analog and digital FEOL devices and circuits. This work provides a complete experimental assessment and quantifies the stress distribution and its effect on front end devices. By using a combined experimental and theoretical approach we provide a framework that will enable stress aware design and the right definition of keep out zone and ultimately save valuable silicon area.

More than 100 cases of sinonasal hemangiopericytoma have been reported in the literature, but only a handful of cases of nasal glomangiopericytoma. In this article, we report a case of a nasal glomangiopericytoma that was treated with endonasal surgical excision. We also attempt to clarify the confusion that attends to the nomenclature surrounding the terms glomangiopericytoma and hemangiopericytoma, which are often used interchangeably. Although glomangiopericytomas are histologically similar to sinonasal hemangiopericytomas, they sometimes behave in a different clinical manner. To further enhance our understanding of nasal glomangiopericytomas, more cases need to be reported. This may improve our ability to establish specific treatment modalities for this type of neoplasm and to predict clinical outcomes.

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The Greek translation of the QBPDS provided reliable and valid instrument for the evaluation of Greek patients with low back pain.