1998
DOI: 10.1016/s0169-4332(97)00683-1
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Pulsed laser deposition as a materials research tool

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Cited by 19 publications
(6 citation statements)
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“…Normally, a congruent transfer of compound targets is observed [ 67 ], nevertheless multiple targets are commonly used as stoichiometry variations can be obtained in a much more easy and flexible way [ 68 ]. Similarly, elimination of particulates or droplets is still an ongoing research topic [ 69 , 70 ]. Currently, PLD is used widely for growth of high temperature superconducting oxides, dielectrics, ferroelectrics and semiconductors.…”
Section: Physical Vapor Depositionmentioning
confidence: 99%
“…Normally, a congruent transfer of compound targets is observed [ 67 ], nevertheless multiple targets are commonly used as stoichiometry variations can be obtained in a much more easy and flexible way [ 68 ]. Similarly, elimination of particulates or droplets is still an ongoing research topic [ 69 , 70 ]. Currently, PLD is used widely for growth of high temperature superconducting oxides, dielectrics, ferroelectrics and semiconductors.…”
Section: Physical Vapor Depositionmentioning
confidence: 99%
“…October 13, 2007 p. 5 Today, PLD is used widely for the deposition of HT c films, as well as for the growth of dielectrics, ferroelectrics, and other materials with complex composition [9].…”
Section: Film Growth Mechanisms In Pldmentioning
confidence: 99%
“…For higher performance applications, such as tunable microwave devices, performance requirements favor the use of processing techniques that are better suited to heteroepitaxial film growth, such as PVD or CVD. The main PVD techniques used for fabricating epitaxial ferroelectric thin films are pulsed laser deposition (PLD) and sputtering (radio frequency, DC magnetron, and ion beam), which permit the layer-by-layer deposition of various dielectrics 21,22 and have demonstrated heteroepitaxial film growth, such as BaTiO 3 23 and BST. 24 The PLD method is suitable to deposit epitaxial films at low substrate temperatures, and the film orientation is readily controlled by the orientation of the single-crystal substrate, which offers numerous advantages, including film stoichiometry close to the target, low contamination level, high deposition rate, and nonequilibrium processing.…”
Section: Materials Processingmentioning
confidence: 99%