Abstract:Small contact hole patterning had become the most difficult task in optical lithography as design rule of semiconductor continuously shrinks below 65nm. Conventional contact hole scheme need to avoid side-lobe and conduct complicated dense-isolated bias for resolution enhancement and depth of focus (DOF) improvement. To overcome this issue, some RETs (Resolution Enhancement Techniques) by process had been investigated, like RELACS (resolution enhancement lithography assisted by chemical shrink). RELACS is one … Show more
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