AlGaN/GaN heterostructure field effect transistors ͑HFETs͒ were prepared on vicinal-cut sapphire substrates. Under reverse bias, it was found that we can achieve smaller gate leakage current and smaller source-drain leakage current by using the 1°tilted substrate. These results could be attributed to the better crystal quality and fewer crystal defects by using vicinal-cut sapphire substrates. With 2 m gate length, the maximum transconductance, G m,max , was 110 mS/mm for the HFETs prepared on vicinalcut sapphire substrates.