“…The increased demand for position-sensitive radiation sensing with enhanced radiation hardness and very good time resolution has paved the way for new solutions and new technologies of semiconductor detector manufacturing, often resulting in a complex 3D (three dimensional) structure of the final device [1,2]. Good examples of such detectors are monolithic silicon pixel detectors [3,4], multipixel silicon LGAD detectors [5][6][7][8], detectors with 3D electrodes (silicon and diamond) [9,10], etc. Studying the charge transport in such structures is most frequently accomplished today by different variations of the TCT (transient current technique) technique, which uses laser light to create charge carriers in certain detector regions, generally through the small openings in electrodes that enable passage of light [11,12].…”