Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics

Xu, Jikai; Du, Yu; Tian, Yanhong; Wang, Chenxi

doi:10.1080/15599612.2020.1857890

Cited by 29 publications

(18 citation statements)

References 159 publications

(230 reference statements)

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“…Compared with thin-film growth and deposition, wafer bonding has many advantages, such as insensitive to lattice mismatch, low temperatures, wafer-scale, etc. [ 112 , 113 , 114 , 115 , 116 , 117 , 118 , 119 ].…”

Section: Heterogeneous Bonding For Wide-bandgap Semiconductors Thin-film Transfer Onto Sic or Diamond Substrates For High Heat Dissipatiomentioning

confidence: 99%

Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Ren

et al. 2021

Micromachines

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Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.

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Section: Heterogeneous Bonding For Wide-bandgap Semiconductors Thin-film Transfer Onto Sic or Diamond Substrates For High Heat Dissipatiomentioning

confidence: 99%

Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Ren

et al. 2021

Micromachines

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“…Since then, many studies have been devoted to the optimization of signal enhancement as well as the application of SEIRA. [15][16][17][18][19] After years of development, SEIRA has become an important vibration spectroscopy technology complementary to SERS. The advantages of SEIRA compared with SERS include: (i) SEIRA has a wider range of applications.…”

Section: Introductionmentioning

confidence: 99%

Infrared metamaterial for surface-enhanced infrared absorption spectroscopy: pushing the frontier of ultrasensitive on-chip sensing

Zhou

Hui

et al. 2021

International Journal of Optomechatronics

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Surface-enhanced infrared absorption (SEIRA) spectroscopy is a powerful technique that overcomes the issue of low molecular absorption cross-sections in infrared spectroscopy. Due to the collective oscillations of electrons in the infrared regime, SEIRA using resonant metamaterial provides greatly enhanced (up to 10 7 ) electromagnetic fields extending up to tens of nanometers from the metamaterial. The enhanced near-field enables spectroscopic analysis and ultrasensitive on-chip sensing of molecules. This interesting characteristic has aroused widespread attention from researchers to SEIRA technology, and various SEIRA-based sensing applications have been continuously emerging. Optimization of the signal enhancement to obtain high sensing performance is the developing main thread of SEIRA technology. In this Review, we provide a basic understanding of SEIRA's sensing mechanism and theoretical model. With this background, several SEIRA optimizing methods are discussed, ranging from design, materials to algorithms. Additionally, perspectives about the future development trends of SEIRA technologies are discussed.

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“…in 1980, [ 18 ] and it is increasingly attracting interest because of its ability to overcome the sensitivity limit by using the near‐field coupling between plasmonic resonances and vibrational modes of target molecules. [ 19 ] Apart from overcoming the sensitivity limit, SEIRA spectroscopy has shown great potential in identifying/characterizing various chemical [ 20 ] and biological molecules, [ 21 ] exploring reaction mechanisms, and monitoring kinetic processes. [ 22 ] This inspired us to explore the possibility of microRNA detection using SEIRA technology and solve potential technical problems to make a significant breakthrough in rapid, label‐free, and ultrasensitive detection of microRNA.…”

Section: Introductionmentioning

confidence: 99%

Infrared Plasmonic Biosensor with Tetrahedral DNA Nanostructure as Carriers for Label‐Free and Ultrasensitive Detection of miR‐155

Hui

Yang

et al. 2021

Advanced Science

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MicroRNAs play an important role in early development, cell proliferation, apoptosis, and cell death, and are aberrantly expressed in many types of cancers. To understand their function and diagnose cancer at an early stage, it is crucial to quantitatively detect microRNA without invasive labels. Here, a plasmonic biosensor based on surface‐enhanced infrared absorption (SEIRA) for rapid, label‐free, and ultrasensitive detection of miR‐155 is reported. This technology leverages metamaterial perfect absorbers stimulating the SEIRA effect to provide up to 1000‐fold near‐field intensity enhancement over the microRNA fingerprint spectral bands. Additionally, it is discovered that the limit of detection (LOD) of the biosensor can be greatly improved by using tetrahedral DNA nanostructure (TDN) as carriers. By using near‐field enhancement of SEIRA and specific binding of TDN, the biosensor achieves label‐free detection of miR‐155 with a high sensitivity of 1.162% pm−1 and an excellent LOD of 100 × 10−15 m. The LOD is about 5000 times lower than that using DNA single strand as probes and about 100 times lower than that of the fluorescence detection method. This work can not only provide a powerful diagnosis tool for the microRNAs detection but also gain new insights into the field of label‐free and ultrasensitive SEIRA‐based biosensing.

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Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics

Cited by 29 publications

References 159 publications

Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Infrared metamaterial for surface-enhanced infrared absorption spectroscopy: pushing the frontier of ultrasensitive on-chip sensing

Infrared Plasmonic Biosensor with Tetrahedral DNA Nanostructure as Carriers for Label‐Free and Ultrasensitive Detection of miR‐155

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