Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Abstract

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.

Reconfigurable terahertz metamaterials: From fundamental principles to advanced 6G applications

“…Micro/nanofluidic is another interesting branch of tunable metamaterial devices for biosensing applications because most of the biomolecular processes happen in the aqueous environment ( Li et al., 2017 , 2018 ; Xu et al., 2020a , 2020b ; Ren et al., 2021a , 2021b ). The fluidic chamber integrated on metamaterial enables the transportation of solutions of different concentrations and components, and the contact with metamaterial hotspots.…”

“…Metamaterials are artificially composed subwavelength structures. With their artificially engineered electrical properties, exotic physical phenomena have been observed in metamaterials, such as negative refractive index ( Pendry, 2000 ; Shelby et al., 2001 ), metalens ( Chen et al., 2017 ; Wang et al., 2018b ; Wang et al., 2019b ; Ren et al., 2021a , 2021b ), slow light effect ( Choi et al., 2011 ; Ma et al., 2018a ; Ma et al., 2018b ; Sun et al., 2020 ) ( Ma et al., 2020a , 2020b ), and perfect absorption ( Hasan et al., 2017 ; Hasan and Lee, 2018 ; Kang et al., 2019 ). Known as “unit cell” or “meta-atom”, the unit structures can vary widely in the geometric parameters.…”

Progress in the Triboelectric Human–Machine Interfaces (HMIs)-Moving from Smart Gloves to AI/Haptic Enabled HMI in the 5G/IoT Era

“…First, the peak-like output signals make the TENG-based sensors only suitable for dynamic stimuli sensing and cannot be used to detect the continuous variation due to the fast shift of electrical states. Though methods based on grating-sliding mode TENG have been frequently reported [133,172], the resolution is limited by the size and spacing of the grating, and is difficult to reach a very high level without advanced fabrication processes [335], e.g., MEMS process, screen printing, micro-machine, etc., which means high fabrication cost. Other methods based on high-impedance readout circuits [149] or nanophotonic modulators [135,336] need complicated measurement systems, which are unlikely to be made into portable sensing devices for daily usage.…”

Suspended Silicon Waveguide with Sub-Wavelength Grating Cladding for Optical MEMS in Mid-Infrared

“…[4][5][6][7][8][9][10][11][12][13]. Silicon photonics, a gradually matured technology in the near-infrared (NIR) telecommunication range, offers a promising solution to photonic integrated circuits (PICs) in low-cost and high-volume manufacturing [14][15][16].…”