Prognostic System for Power Modules in Converter Systems Using Structure Function

Aliyu, Attahir Murtala; Castellazzi, Alberto

doi:10.1109/tpel.2017.2672823

Cited by 40 publications

(6 citation statements)

References 26 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The thermal transient analysis can be used for the thermal characterization of the power module, allowing to discriminate between different potential failure mechanism. According to [10] and [11], the thermal impedance can be derived from the cooling curve of the component. Subsequently, the Foster and Cauer thermal models of the power module can be computed using mathematical transformations.…”

Section: Validation Of the Methodology With Ir Thermographymentioning

confidence: 99%

Experimentally validated methodology for real-time temperature cycle tracking in SiC power modules

Stella

Olanrewaju

Yang

et al. 2018

Microelectronics Reliability

View full text Add to dashboard Cite

The ability to monitor temperature variations during the actual operation of power modules is key to reliability investigations and the development of lifetime prediction strategies. This paper proposes an original solution, specifically devised with novel fast-switching silicon carbide (SiC) power MOSFETs in mind. The results show ability to track temperature variations resulting from active power cycling of the devices, including high speed transients, thus enabling to discriminate among different potential failure mechanisms. Validation of the proposed methodology and its accuracy is carried out with the support of infrared thermography.

show abstract

Section: Validation Of the Methodology With Ir Thermographymentioning

confidence: 99%

Experimentally validated methodology for real-time temperature cycle tracking in SiC power modules

Stella

Olanrewaju

Yang

et al. 2018

Microelectronics Reliability

View full text Add to dashboard Cite

show abstract

“…One prime example is CTE mismatch due to different CTE between various components within the power module, resulting in thermomechanical stress and leading to pre-mature insulation failure and breakdown [24], [25].…”

Section: Ieee Transactions On Dielectrics and Electrical Insulationmentioning

confidence: 99%

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

Adhikari,

Ghassemi

2024

IEEE Trans. Dielect. Electr. Insul.

View full text Add to dashboard Cite

Within the expanding domain of electrical power demand, the future of power module packaging is entwined with the progress of (ultra) wide bandgap (UWBG) materials. These materials, like silicon carbide (SiC), aluminum nitride (AlN), and diamond, offer advantages with higher power density, decreased weight, and expanded operational abilities regarding temperature, voltage, and frequency. However, the pursuit of pushing these limits confronts challenges within insulation systems, which may struggle to endure the demands of these parameters, potentially resulting in unfavorable conditions like high electric field, space charge accumulation, electrical treeing, and partial discharge (PD), leading to insulation failure. The emphasis of this paper is to review the insulation challenges within (U)WBG power modules and recent research in mitigating the electric field stress at triple points (TPs) and resolving the PD issues. The manuscript first discusses the high electric field stress issue at triple points. Then, ceramic substrate materials, encapsulation materials, and the influence of harsh weather conditions on them are reviewed. The space charge, electrical treeing, and PD issues within encapsulation materials are analyzed under practical operation conditions of (U)WBG power modules like high frequency, temperature, and square wave pulses. Finally, the various strategies to alleviate the associated insulation challenges are meticulously discussed. While the identified mitigation strategies are able to strengthen insulation systems for packaging, their validation under actual operational conditions of (U)WBG power modules remains relatively unexplored, representing a potential avenue for further investigation. This review offers a valuable framework by providing the constraints of the current studies and recommendations for the future that can be utilized as a reference point for future research endeavors. Index Terms-(U)WBG power module packaging, partial discharge, triple points, encapsulation material, electric field stress, high power density, field grading materials, nonlinear field-dependent conductivity layerThis paragraph of the first footnote will contain the date on which you submitted your paper for review, which is populated by IEEE.

show abstract

“…A more insightful method to track degradation in the thermal path is through the estimation of the structure function of the package [101][102][103][104][105][106][107][108][109]. Fig.…”

Section: ) Degradation Precursors Estimationmentioning

confidence: 99%

A Review on IGBT Module Failure Modes and Lifetime Testing

2021

View full text Add to dashboard Cite

Prognostic System for Power Modules in Converter Systems Using Structure Function

Cited by 40 publications

References 26 publications

Experimentally validated methodology for real-time temperature cycle tracking in SiC power modules

Experimentally validated methodology for real-time temperature cycle tracking in SiC power modules

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

A Review on IGBT Module Failure Modes and Lifetime Testing

Contact Info

Product

Resources

About