Experimentally validated methodology for real-time temperature cycle tracking in SiC power modules

Stella, Fausto; Olanrewaju, Olufisayo; Yang, Zineng; Castellazzi, Alberto; Pellegrino, Gianmario

doi:10.1016/j.microrel.2018.07.072

Cited by 8 publications

(5 citation statements)

References 11 publications

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“…It has been expected due to the previous literature findings such as [17]. The quite good correlation between the average temperature detected by infrared camera and the indirect temperature estimated by TSEP has been aligned with other literature results for single SiC power MOSFET device [18] and IGBT power modules, also considering the behavior of two paralleled dies [19].…”

Section: Thermo-camera Validationsupporting

confidence: 88%

Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling

et al. 2021

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Section: Thermo-camera Validationsupporting

confidence: 88%

Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling

et al. 2021

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“…The same technique was previously validated on a proof-ofconcept prototype based on an H-Bridge SiC MOSFET power module where the temperature of one of the switches was estimated using the same temperature estimator shown in this paper [30]. The H-bridge validation test rig presented in [30] is shown in Fig. 20.…”

Section: E Goodness Of the Resultsmentioning

confidence: 99%

“…Another approach for validation would use less invasive optical fibres that allow only a punctual measurement of temperature to be performed. However, the temperature gradient across the die of a semiconductor during its working operations can reach tens of degrees as shown in [30], [31]. An indirect form of validation is provided in Fig.…”

Section: E Goodness Of the Resultsmentioning

confidence: 99%

“…Fig. 20 Thermographic validation previously provided in [30] where the same temperature estimation technique was applied to a SiC MOSFET power module in H-bridge configuration. On the right side is visible the measured temperature on the semiconductor surface, where the borders of the chip are highlighted by the black dashed line.…”

Section: E Goodness Of the Resultsmentioning

confidence: 99%

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Coordinated Online Junction Temperature Estimation of MOSFETs and Antiparallel Diodes in Three-Phase SiC Inverters

Stella,

Pellegrino,

Armando

2023

IEEE J. Emerg. Sel. Topics Power Electron.

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SiC power MOSFETs guarantee high power density and high efficiency in new generation power converters. The precise measurement of the devices junction temperature is important in this context for guaranteeing the reliability of the converter and the full exploitation of power semiconductors. While the use of Temperature Sensitive Electrical Parameters (TSEPs) has proven effective and feasible, their application in realworld power converters remains limited. Besides SiC MOSFETs, the temperature of the antiparallel diode is often overlooked and considered non critical. However, monitoring the temperature of all power electronic devices, diodes included, offers augmented reliability, adaptive adjustment of the converter's peak current at no risk of failure and advanced diagnostics. This paper shows that the on-board measurement of the conduction voltage of the SiC MOSFETs and antiparallel diodes can be used for the direct estimate of the respective junction temperatures in a 3-phase voltage source inverter. The diode temperatures come with no hardware complication, with respect to what is already in place for SiC MOSFETs characterization and estimate. The proposed methodology is validated on a proof-of-concept 2-level 3-phase inverter designed for the Formula SAE student electric competitions, showing the temperature estimate of the six MOSFETs and diodes at overload current operation.

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“…The soft-switching HF converter operation is experimentally validated in an actual 25 kW, [31] (800 V of DC bus) SiC MOSFETs-based DC-DC full-bridge converter, devoted to the first stage of an isolated charger circuit [32]. The simplified schematic of the power converter is reported in Figure 17a.…”

Section: A Case Of Studymentioning

confidence: 99%

Soft-Switching Full-Bridge Topology with AC Distribution Solution in Power Converters’ Auxiliary Power Supplies

et al. 2022

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The auxiliary power supply in a power converter is a key topic in the optimization of the converter’s low-voltage electronic circuit performance. In this article, a low-voltage DC-AC soft-switching full-bridge topology, with an innovative, driven technique to achieve a zero-voltage transition, is presented and discussed. The full-bridge converter drives a high-frequency transformer (called the main transformer) that on the secondary side, distributes an AC voltage and current to the several electronic circuit’s supplies. Every power supply is composed of an HF transformer (called load transformer) that converts the AC secondary voltage of the main transformer to the voltage and current levels requested by the electronic circuit. In this paper, the operating conditions are first investigated by several simulation results. Furthermore, an actual DC-DC power converter is used as a workbench for an experimental investigation of the effectiveness of the proposed auxiliary DC-AC soft-switching topology, and the AC distribution approach, to realize the several points of load power supply requested. Finally, the advantages and drawbacks of this auxiliary power supply solution are critically discussed, providing guidelines for the power converter designer.

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Experimentally validated methodology for real-time temperature cycle tracking in SiC power modules

Cited by 8 publications

References 11 publications

Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling

Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling

Coordinated Online Junction Temperature Estimation of MOSFETs and Antiparallel Diodes in Three-Phase SiC Inverters

Soft-Switching Full-Bridge Topology with AC Distribution Solution in Power Converters’ Auxiliary Power Supplies

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