A predeposition
GaN process is innovatively proposed to solve the
process repeatability problem of AlN buffer layer growth. First of
all, it was speculated that the predeposited materials that may be
present are Al, Ga, AlN, and GaN based on the introduced reaction
sources. Then, the adsorption rate of each substance on the AlN surface
was calculated and compared through theoretical derivation and first-principles
calculation. We found that the adsorption rates of Al, Ga, AlN, and
GaN on AlN surfaces are all in the same order of magnitude, indicating
that Al, AlN, Ga, and GaN may coexist and affect the repeatability
of the AlN film growth process together. Then, a process for suppressing
impurities during AlN film growth was proposed: GaN is predeposited
in the reaction chamber before the AlN film is grown, so that Al,
Ga, or AlN remaining in the chamber when the AlN or AlGaN film is
grown before is covered to create a single growth environment. To
verify the effectiveness and reliability of this process, the reflectivity
curve and crystal quality of AlN were compared. The result reveals
that the GaN predeposition process can effectively improve the repeatability
of AlN buffer layer growth. Moreover, the crystal quality of AlN is
improved as well.