Processing and properties of Cu based micro- and nano-composites

Panda, Sagar Suman; Dash, K.; Ray, Bankim Chandra

doi:10.1007/s12034-014-0643-8

Cited by 19 publications

(10 citation statements)

References 38 publications

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“…In the ex-situ method, ceramic particles such as TiB2, TiC, and oxide are introduced into the metal matrix via powder metallurgy or conventional casting methods [3,4]. However, the CMCs fabricated by these methods revealed a drawback because of poor interfacial bonding between reinforcement particles and copper matrix [5].…”

Section: Introductionmentioning

confidence: 99%

Characterization of In-Situ Cu–TiH2–C and Cu–Ti–C Nanocomposites Produced by Mechanical Milling and Spark Plasma Sintering

Oanh

Việt

Kim

et al. 2017

Metals

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This study focuses on the fabrication and microstructural investigation of Cu-TiH2-C and Cu-Ti-C nanocomposites with different volume fractions (10% and 20%) of TiC. Two mixtures of powders were ball milled for 10 h, consequently consolidated by spark plasma sintering (SPS) at 900 and 1000 • C producing bulk materials with relative densities of 95-97%. The evolution process of TiC formation during sintering process was studied by using X-ray diffraction (XRD), scanning electron microscopy (SEM), and high resolution transmission electron microscopy (HRTEM). XRD patterns of composites present only Cu and TiC phases, no residual Ti phase can be detected. TEM images of composites with (10 vol % TiC) sintered at 900 • C show TiC nanoparticles about 10-30 nm precipitated in copper matrix, most of Ti and C dissolved in the composite matrix. At the higher sintering temperature of 1000 • C, more TiC precipitates from Cu-TiH2-C than those of Cu-Ti-C composite, particle size ranges from 10 to 20 nm. The hardness of both nanocomposites also increased with increasing sintering temperature. The highest hardness values of Cu-TiH2-C and Cu-Ti-C nanocomposites sintered at 1000 • C are 314 and 306 HV, respectively.

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Section: Introductionmentioning

confidence: 99%

Characterization of In-Situ Cu–TiH2–C and Cu–Ti–C Nanocomposites Produced by Mechanical Milling and Spark Plasma Sintering

Oanh

Việt

Kim

et al. 2017

Metals

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“…So, an increase in the content of the TiC nanoparticles in the copper matrix resulted in a decrease in the size of the copper crystallites in the sintered composites. Indeed, TiC nanoparticles have been shown to restrict grain growth of the copper matrix during sintering [23]. An additional confirmation of good dispersion of the TiC nanoparticles in the copper matrix in the sintered nanocomposites is presented in Figure 10, which shows scanning TEM images and the corresponding EDS profiles of nanocomposites A and B of the 20 vol % TiC-Cu composition: the size of the "waves" on the Ti concentration profiles along the x-axis (distance) corresponds well to the size of the TiC nanoparticles introduced into the copper matrix through ball milling.…”

Section: Resultsmentioning

confidence: 99%

Structural Investigations of TiC–Cu Nanocomposites Prepared by Ball Milling and Spark Plasma Sintering

Oanh

Hoàng

Kim

et al. 2017

Metals

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Abstract:In this work, TiC-Cu composites containing 20 and 30 vol % of nano-sized titanium carbide (TiC) particles were prepared by powder metallurgy using copper powders with micrometer-sized and nanometer-sized particles. Mixtures of TiC and Cu powders were ball milled for 10 h and spark plasma sintered at 800-900 • C under an applied pressure of 50 MPa. The relative density of the sintered composites was 95.0%-96.5%. The composites fractured in a ductile mode. The crystallite size of the copper matrix in the composites prepared using the nanometer-sized copper powder was smaller than that in composites prepared using the micrometer-sized copper powder, which was confirmed by transmission electron microscopy (TEM). The hardness of the composites increased as the sintering temperature was increased from 800 to 900 • C. When the TiC content increased from 20 to 30 vol %, the hardness of the composites obtained from the micrometer-sized copper powder and sintered at 900 • C increased from 284 to 315 HV, while in composites obtained from the nanometer-sized copper, the hardness decreased from 347 to 337 HV.

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“…Varying the percentage of the ceramic reinforcement from 8 to 20 wt% the hardness increased from 69 to 88 HV 5 . This behavior exposes good physical adhesion between the metal-ceramic phases [17] [18].…”

Section: Properties Of Compositesmentioning

confidence: 85%

The Microstructure and Properties of Copper with Ceria Nanoparticles Addition

Fonseca¹,

Monteiro²

2019

MSCE

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Copper-based composites strengthened by ceria nanoparticles were processed by conventional powder metallurgy: mixing (30 min and 46 rpm), compaction (cold, uniaxial, 1080 MPa for 10 s) and sintering (800˚C for 6 h in vacuum atmosphere of 10 −5 torr). It was studied the microstructure (optical microscopy, scanning electron microscopy), X-ray diffraction with Rietveld refinement and some properties (electrical conductivity, Vickers hardness and fracture analysis) of the compositions 92 wt% Cu -8 wt% CeO 2 and 80 wt% Cu -20 wt% CeO 2 . The results showed uniform phase distribution, low porosity and ceria disperse inside copper grain. In despite of properties, the composites had electrical conductivity of 38% IACS and 15% IACS and hardness of 69 and 88 HV 5 , respectively. The results of 92 wt% Cu -8 wt% CeO 2 composites were promising, and they are in according with actual literature. Hardness searches is to get values of electrical conductivity who allow commercial uses of the material [1] [2] [3]. Various inert particles such as SiC, SiO

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Processing and properties of Cu based micro- and nano-composites

Cited by 19 publications

References 38 publications

Characterization of In-Situ Cu–TiH2–C and Cu–Ti–C Nanocomposites Produced by Mechanical Milling and Spark Plasma Sintering

Characterization of In-Situ Cu–TiH2–C and Cu–Ti–C Nanocomposites Produced by Mechanical Milling and Spark Plasma Sintering

Structural Investigations of TiC–Cu Nanocomposites Prepared by Ball Milling and Spark Plasma Sintering

The Microstructure and Properties of Copper with Ceria Nanoparticles Addition

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