The Microstructure and Properties of Copper with Ceria Nanoparticles Addition

Abstract

Copper-based composites strengthened by ceria nanoparticles were processed by conventional powder metallurgy: mixing (30 min and 46 rpm), compaction (cold, uniaxial, 1080 MPa for 10 s) and sintering (800˚C for 6 h in vacuum atmosphere of 10 −5 torr). It was studied the microstructure (optical microscopy, scanning electron microscopy), X-ray diffraction with Rietveld refinement and some properties (electrical conductivity, Vickers hardness and fracture analysis) of the compositions 92 wt% Cu -8 wt% CeO 2 and 80 wt% Cu -20 wt% CeO 2 . The results showed uniform phase distribution, low porosity and ceria disperse inside copper grain. In despite of properties, the composites had electrical conductivity of 38% IACS and 15% IACS and hardness of 69 and 88 HV 5 , respectively. The results of 92 wt% Cu -8 wt% CeO 2 composites were promising, and they are in according with actual literature. Hardness searches is to get values of electrical conductivity who allow commercial uses of the material [1] [2] [3]. Various inert particles such as SiC, SiO