“…[7][8][9][10] Tungsten (W) has the most attention among various materials as the next-generation word line to replace silicon, due to advantage such as high thermal stability, sheet resistance lower than 5 X/sq, uniform resistance per area regardless of pattern size, and excellent patterning properties due to the small grain size. [11][12][13][14] Other properties required for nanoscale patterning regarding factors such as contamination, morphology, resistance control, surface reaction, and patterning properties have been considered. 11,15 However, the oxidation of tungsten surfaces during processing is a critical problem that needs to be solved for the application of tungsten as the word line for nanoscale semiconductor devices.…”