Process Development for a High-throughput Fine Line Metallization Approach Based on Dispensing Technology

Pospischil, Maximilian; Klawitter, M.; Kuchler, M.; Specht, J.; Gentischer, Harald; Efinger, Raphael; Kröner, C.; Luegmair, M.; König, Markus; Hörteis, M.; Mohr, Carsten; Wende, L.; Lossen, J.; Weiß, M.; Doll, O.; Koehler, Ingo; Zengerle, Roland; Clement, Florian; Bíro, D.

doi:10.1016/j.egypro.2014.02.001

Cited by 34 publications

(16 citation statements)

References 4 publications

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“…In order to increase process stability and throughput rate, future process optimizations needs to take into consideration a parallelization of nozzles by a print head development with an optimized flow geometry e.g. by a CFD simulation approach 13,28 . For paste development, investigations of storage stability, slip behavior within the nozzle as well the parallel print head geometry and suitable particle choices which enables an increase in electrical conductivity by a few orders of magnitude should be considered.…”

Section: Discussionmentioning

confidence: 99%

Conductive Highly Filled Suspensions for an Electrochemical Dispensing Approach to Pattern Full-Area Thin Metal Layers by Physical Vapour Deposition

Gensowski

Tepner

Schweigert

et al. 2020

Sci Rep

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This paper presents a systematic approach for the development of highly filled suspensions used for an electrochemical dispensing approach. electrochemical dispensing is an alternative structuring process to locally pattern pVD full-area thin metal layers with the goal to create contacts on solar cells or circuit boards by anodic metal dissolution. Achieving a narrow patterned line width requires a dispensing paste with a high yield stress, a small particle size distribution and a good electrical conductivity. Therefore this work focuses on the formulation and characterization of dispensing pastes in terms of their rheological and electrical properties and their particle size distribution. Furthermore, the printing performance is evaluated in dispensing experiments. In this study, samples with a yield stress above 5000 Pa and an average particle size below 0.4 µm were produced, resulting in dispensed line widths below 100 µm with a high aspect ratio above 0.6. The lack of electrical conductivity was solved by adding KCl solution to the paste, which will add to the ionic conductivity of the NaNO 3 basis paste formulation. With this approach, printed line widths down to 115 µm and etched line widths below 90 µm at high aspect ratio were achieved on 50 nm aluminum layers.

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Section: Discussionmentioning

confidence: 99%

Conductive Highly Filled Suspensions for an Electrochemical Dispensing Approach to Pattern Full-Area Thin Metal Layers by Physical Vapour Deposition

Gensowski

Tepner

Schweigert

et al. 2020

Sci Rep

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“…Parallel dispensing is such a technique, which has been under development for a while [52,53]. At the workshop, it was shown that, while linewidth is in the same range as what can be achieved by fine-line screen printing, aspect ratio and variability are markedly better for dispensed lines, provided that appropriately modified Ag pastes are used [54,55].…”

Section: Alternative Metallizationsmentioning

confidence: 99%

Summary of the 5th Workshop on Metallization for Crystalline Silicon Solar Cells

Beaucarne¹,

Schubert

Hoornstra

2015

Energy Procedia

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The 5 th Metallization Workshop took place in Constance, Germany on 20 and 21 October 2014 and provided an overview of research and development in the field of solar cell metallization. Enhanced understanding of contact structure and formation was obtained thanks to new characterization techniques. Great progress in metallization technologies was also reported. Screen printing technology is continuing its trajectory of continuous improvement, notably with fine-line screen printing (linewidth < 50 μm) becoming a reality. Ni/Cu plating technology is also progressing fast, with many of the technical barriers to adoption being successfully removed. Finally, the workshop also highlighted the move towards a module-centric design of solar cell metallization, targeting high performance and low cost at module level.

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“…Recently, high efficiency concepts for crystalline silicon solar cells are under extensive investigation . In order to improve the conversion efficiency of the silicon solar cells, several metallization techniques have been investigated such as aerosol jet printing, inkjet printing, metal plating and dispensing . Of these techniques, the inkjet printing process of metal nanoparticles for the front side metallization of silicon solar cells has been highlighted as a potential candidate to replace the current screen printing process .…”

Section: Introductionmentioning

confidence: 99%

Nano‐glass frit for inkjet printed front side metallization of silicon solar cells prepared by sol–gel process

Kang

Lee

Chung

et al. 2015

Physica Rapid Research Ltrs

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Sol–gel derived nano‐sized glass frits were incorporated into the Ag conductive ink for silicon solar cell metallization. This mixture was specifically formulated for inkjet printing on textured Si wafers with 80 nm thick SiNx anti reflection coating layers. The correlation between the contact resistance and interface microstructures were studied using scanning electron microscopy and transmission electron microscopy. In addition, the specific contact resistance between the front contact and emitter was measured at various firing conditions using the transfer length model. On an emitter with the sheet resistance of 60 Ω/sq, a specific contact resistance below 5 mΩ cm2 could be achieved at a peak firing temperature around 800 °C. We found that the incorporated nano‐glass frit act as a very effective fire through agent, and an abundant amount of Ag crystallites was observed along the interface glass layer. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)

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Process Development for a High-throughput Fine Line Metallization Approach Based on Dispensing Technology

Cited by 34 publications

References 4 publications

Conductive Highly Filled Suspensions for an Electrochemical Dispensing Approach to Pattern Full-Area Thin Metal Layers by Physical Vapour Deposition

Conductive Highly Filled Suspensions for an Electrochemical Dispensing Approach to Pattern Full-Area Thin Metal Layers by Physical Vapour Deposition

Summary of the 5th Workshop on Metallization for Crystalline Silicon Solar Cells

Nano‐glass frit for inkjet printed front side metallization of silicon solar cells prepared by sol–gel process

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