Abstract:Developing suitable processes for thin wafer fast recovery power diodes is important for modern production plants as the substrate dimension increases. A set of emerging technologies has been employed here in order to fabricate 1700V rated fast recovery diodes from standard Si IGBT substrates without pre-diffused backside n-type buffer. Wafer grinding, n + back surface contact implant, laser annealing and multiple proton implantations were all employed here for the diode fabrication. Detailed processing parame… Show more
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