Printed circuit pack (PCP) yield prediction

Synthesis of colloidal silver nanoparticles for printed electronics

“…Recently, wide attention has been focused on the development of convenience and low-cost processing techniques to deposit conductive features on a nano-biocomposite substrate [1][2][3][4] flexible display. Direct-write techniques, one type of printable electronics [5,6] with the feature of low conductive ink consumption, have attracted interest of many industrial applications such as printed circuit board and display device, because they promised the simplification of device manufacturing. Among multiple direct-write technologies, a drop-on demand inkjet printing technology [7][8][9] is currently used as the high potential method in the printing industry due to low instrument cost and fewer processing steps compared with other patterning processes.…”

On the use of yielded cost in modeling electronic assembly processes

“…A close look at the electronic and mechanical systems cost modeling literature indicates that cost divided by yield appears frequently, examples include integral passive modeling [5], yield prediction and associated cost for printed circuit packs [6], integrated optical chips [7], VLSI floorplanning [8], flip chip and wire bonding [9], expected profit models for multi-stage manufacturing systems [10], the implementation of inspection costs for optimal lot sizing [11], and cost of ownership (COO) applications [12] and [13]. Actual references to the specific concept of yielded cost have also appeared in the literature, mostly as a means of developing cost models, e.g., Matsuno et al [1] addresses yielded cost in a paper on the development of a yield and cost-forecasting model for monolithic microwave integrated circuits (MMICs).…”