Abstract:Yielded cost is defined as cost divided by yield and can be used as a metric for representing an effective cost per good (non-defective) assembly for a manufacturing process. Although yielded cost is not a new concept, it has no consistent definition in engineering literature, and several different formulations and interpretations exist in the context of manufacturing and assembly. In manufacturing, yield is the probability that an assembly is non-defective. To find the effective cost per good assembly that is… Show more
“…Yielded cost is defined as cost divided by yield. In electronic assembly, yielded cost represents the effective cost per good (non-defective) assembly for a manufacturing process [14]. Figure 5 shows that when false positives are created and rework yield is low, there is an optimum number of rework attempts per part (2 for Y rew = 30%, 1 for Y rew = 10% or less).…”
This paper presents a test/diagnosis/rework analysis model for use in technical cost modeling of electronic assemblies. The approach includes a model of test operations characterized by fault coverage, false positives, and defects introduced in test, in addition to rework and diagnosis operations that have variable success rates and their own defect introduction mechanisms. The model can accommodate an arbitrary number of rework attempts on any given assembly and can be used to optimize the fault coverage and rework investment during system tradeoff analyses. The model's implementation allows all inputs to the model to be represented as probability distributions thereby accommodating inevitable uncertainties in input data present during tradeoff activities and uses Monte Carlo methods to determine model outputs.
“…Yielded cost is defined as cost divided by yield. In electronic assembly, yielded cost represents the effective cost per good (non-defective) assembly for a manufacturing process [14]. Figure 5 shows that when false positives are created and rework yield is low, there is an optimum number of rework attempts per part (2 for Y rew = 30%, 1 for Y rew = 10% or less).…”
This paper presents a test/diagnosis/rework analysis model for use in technical cost modeling of electronic assemblies. The approach includes a model of test operations characterized by fault coverage, false positives, and defects introduced in test, in addition to rework and diagnosis operations that have variable success rates and their own defect introduction mechanisms. The model can accommodate an arbitrary number of rework attempts on any given assembly and can be used to optimize the fault coverage and rework investment during system tradeoff analyses. The model's implementation allows all inputs to the model to be represented as probability distributions thereby accommodating inevitable uncertainties in input data present during tradeoff activities and uses Monte Carlo methods to determine model outputs.
“…The yielded cost we are interested in is the final cost per product instance (after the final processing step and/or TDR operation) divided by the final product yield (see [11] for a discussion of "yielded cost"). This yielded cost gives a measure of the effective cost per good product instance after all the manufacturing and TDR operations are completed.…”
Abstract. In this paper, an optimization methodology is used to select the locations and characteristics of test, diagnosis and rework operations in electronic systems assembly processes. Real-coded genetic algorithms are used to perform a multi-variable optimization that minimizes the yielded cost of products resulting from an assembly process that includes test/diagnosis/rework operations characterized by costs, yields fault coverage, and rework attempts. A general complex process flow is analyzed using the algorithms proposed in this paper, and a multichip module assembly process flow is used to demonstrate that the methodology can identify optimum test and rework solutions that result in a reduction in yielded cost.
“…The critical yield parameter not explicitly considered is the board yield (see Chapter 8). The foregoing discussion effectively assumes that the layer pair cost with embedded passives, C new pair layer , computed in ( 13) is a yielded cost, i.e., the cost per good (non-defective) layer pair, [18]. This quantity can be interpreted as yield Figure 4 -Application-specific economical regions of trimming and reworking embedded resistors.…”
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