Printable Copper Sensor Electronics for High Temperature

Abstract

Copper conductive inks are attracting immense interest given their augmenting contribution to the field of printed electronics, while its high-temperature conducting performance is indispensable. This study highlights a copper-based printable ink with high electrical conductivity at elevated temperatures for an increased operating life and capable of adhering to any geometric surface. The in situ formed copper−graphene printed conductor displays an electrical conductivity of 8 × 10 5 S/m and maintains its stability up to 650 °C. Furthermore, high-temperature Cu sensor electronics are fabricated by using 3D printing, which paves the way for the resistance thermometer sensors and flexible electronics applications.

Flexible Copper–Graphene Nanoplates on Ceramic Supports for Radiofrequency Electronics with Electromagnetic Interference Shielding and Thermal Management Capacity

“…We incorporate graphene into the printed Cu nanoplates by means of an in situ conversion process, by adding dopamine to the ink and subsequently sintering them after printing at an elevated temperature to accentuate the conversion of the carbocyclic structure to graphene. 30 The X-ray diffraction (XRD) measurement shows a prominent peak for the Cu(111) (Figure S1a). Consequently, after sintering the printed conductive pattern, we observed a continuous and adequately smooth landscape [scanning electron microscopy (SEM) image depicted in Figure 1b], confirming the formation of a large percolation network of the Cu nanoplate surface resulting in higher conductivity.…”

“…Figure a illustrates the printing technique utilized for the fabrication of the flexible antenna and the coating utilized for determining the EMI shielding effectiveness with a controllable dimension using an extrusion-based 3D-printing technique. We incorporate graphene into the printed Cu nanoplates by means of an in situ conversion process, by adding dopamine to the ink and subsequently sintering them after printing at an elevated temperature to accentuate the conversion of the carbocyclic structure to graphene . The X-ray diffraction (XRD) measurement shows a prominent peak for the Cu(111) (Figure S1a).…”

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

“…At present, direct metal laser sintering (DMLS) is employed for the primary sintering process for 3D metal printing using metal powders. The development of Cu-based/pastes for metal 3D printing is a great challenge to produce highly conductive 3D architectures using a cost-effective heating process at low-temperatures [ 178 , 179 , 180 ].…”

Control of Surface Wrinkling through Compliant Nanostructured Interfaces

“…[ 27,29 ] Cu was selected because of its high electrical and thermal conductivities that permit applications in flexible electronics. [ 34–37 ] Optimal GLAD processing parameters, including the deposition rate, deposition angle, and substrate rotation speed are identified to produce regular nanostructures with periodic features and thicknesses of the order of micrometers. An analytical model formulated by Lejeune et al.…”

“…[ 38,39 ] Notably, all prior studies have focused only on the out‐of‐plane compressive modulus of nanoarchitectured GLAD films, and the effective in‐plane compressive film modulus is yet to be obtained. [ 24,26,33–41 ] The challenge in measuring the in‐plane compressive modulus stems from the discontinuous nature of GLAD films which cannot be removed from the growth substrate to be tested. In this study, wrinkling is taken advantage of to obtain for the first time the effective in‐plane Young's modulus of both isotropic (spring‐like) and orthotropic (chevron‐like) GLAD films.…”