Preparation of β‐SiCw/BDM/DBA composites with excellent comprehensive properties

Abstract

Functionalized β‐SiC whiskers (β‐SiCw) are employed to prepare β‐SiCw/N,N′‐4, 4′‐bimaleimide diphenyl methane/diallylbisphenol A (β‐SiCw/BDM/DBA) composites via powder blending‐casting method. The thermal conductive coefficient of the β‐SiCw/BDM/DBA composites is 0.994 W/mK with 40 wt% functionalized β‐SiCw, five times higher than that of pure BDM/DBA. The mechanical properties of the β‐SiCw/BDM/DBA composites are optimal with 10 wt% functionalized β‐SiCw. Both thermal resistance and dielectric constant are increased with the increasing addition of β‐SiCw. For a given β‐SiCw loading, the surface functionalization of β‐SiCw exhibits a positive effect on the thermal conductivities and mechanical properties of the β‐SiCw/BDM/DBA composites. POLYM. COMPOS., 35:1875–1878, 2014. © 2014 Society of Plastics Engineers

Preparation and properties of epoxy/BN highly thermal conductive composites reinforced with SiC whisker

“…. As a result, it may increase the flexible chain segments, thus to improve the dipole orientation polarization and relaxation . Therefore, obvious increase of dielectric constant is shown with further introduction of 3% KH560‐SiCw.…”

“…In the FTIR spectrum of SiCw, the intensity of the peak at 800 cm 21 (SiAC) is obviously stronger than that at 1,100 cm 21 (SiAO), while in the spectrum of KH560-SiCw, the latter is stronger conversely. Furthermore, the band at 1,380 cm 21 ascribed to the CAH bond becomes remarkable in the case of KH560-SiCw, which suggests a coating of KH560 has been formed on the surface of SiCw [30,33,34].…”

“…Epoxy resin and BN are selected as polymer matrix and thermal conductive filler separately. SiC whisker (SiCw), possesses outstanding thermal conductivity, excellent strength, and dielectric properties, which has been widely used in high performance composites . Therefore, it is incorporated to improve the mechanical properties and further increase the thermal conductivity of composites with high filler loadings.…”

Research on the Compound Optimization Method of the Electrical and Thermal Properties of SiC/EP Composite Insulating Material

“…Filled thermally conductive polymers are simple to operate, low in cost, suitable for industrial production and have become the mainstream development direction of high thermally conductive insulating materials. [ 1 , 2 , 3 , 4 , 5 , 6 , 7 ].…”

Ideal dielectric thermally conductive bismaleimide nanocomposites filled with polyhedral oligomeric silsesquioxane functionalized nanosized boron nitride

“…Bismaleimide (BMI) resins possess excellent dielectric properties, outstanding thermal stabilities, excellent mechanical properties, good humidity & corrosion resistance and an attractive cost/performance ratio, and have been widely applied in the elds of electronics, insulation, adhesives and other key areas. [1][2][3][4][5][6] However, the main disadvantages of BMI matrices, such as inherent brittleness, 7 poor processing characteristics, low thermal conductivity, 8,9 etc., have limited their broader application, especially in the elds of electronic and micromechanical devices which need materials with excellent dielectric properties, high thermal conductivities and outstanding thermal stabilities. [10][11][12] At present, many methods have been proposed to improve the toughness of the BMI matrix, but the corresponding thermal resistance and dielectric properties are oen decreased inevitably.…”