Ideal dielectric thermally conductive bismaleimide nanocomposites filled with polyhedral oligomeric silsesquioxane functionalized nanosized boron nitride

Gu, Junwei; Liang, Chaobo; Dang, Jing; Dong, Wencai; Zhang, Qiuyu

doi:10.1039/c6ra04513h

Cited by 158 publications

(75 citation statements)

References 31 publications

(29 reference statements)

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“…[120]. In Gu's previous work [121], based on the method of mechanical ball-milling followed by mold pressing, the obtained λ value of the functionalized graphite nanoplatelets/polyphenylene (fGNPs/PPS) composite with 40 wt% fGNPs could be greatly improved to 4.414 W/mK, 19 times higher than that of the original PPS matrix.…”

Section: Powder Blendingmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

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289

124

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With the fast-developing miniaturization and integration of microelectronics packaging materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model and equations, mechanisms, commonly used thermally conductive fillers, and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the λ value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.

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Section: Powder Blendingmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

Self Cite

289

124

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“…SSQs, especially POSS, are attractive hybrid nanomaterials that can provide polymers with superior thermal properties. [11,26,[36][37][38][39][40][41][42][43][44][45][46][47][48][49] SSQs with a rigid Si-O-Si framework show excellent thermal properties and SSQcontaining polymers exhibit good thermal properties even after a physical blending process. [38,[49][50][51][52][53] As a kind of organic-inorganic hybrid nanomaterials with a nanocage structure, SSQs have good interface interactions with polymers and show excellent thermal and mechanical stability.…”

Section: Enhancement Of the Thermal Properties Of Polymersmentioning

confidence: 99%

Silsesquioxane‐Containing Hybrid Nanomaterials: Fascinating Platforms for Advanced Applications

Dong

2019

Macro Chemistry & Physics

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Silsesquioxanes (SSQs), with the general formula, (RSiO1.5)n—where R stands for an organic group, such as alkyl, aryl, alkoxy, or H—are a type of molecular‐level organic/inorganic hybrid silica‐based material. These materials contain reactive or nonreactive organic moieties as well as inorganic Si–O–Si frameworks. In the past few years, extensive efforts have been made using SSQs to construct multifunctional nanocomposites with suitable properties for a range of applications. In this review, the recent various applications of SSQ‐containing hybrid materials are discussed, in addition to updates of the nanocomposite applications. Various physical structures and chemical reactions in SSQ‐based hybrid nanomaterials are emphasized with regard to applications in the field of polymer nanocomposites, catalysts, adsorption, sensors, and biomedicine. This review focuses on results reported in the recent five years (2013–2018).

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“…Silica has been applied as a dielectric material in the past. Some researchers mixed various forms of silica in polyimide to form composites: silica tubes, silica zeolite nanocrystal particles, silica nanocomposite nanofoams, polyhedral oligomeric silsesquioxane . Generally, the dielectric constant of polyimide composites was 2.56–3.42 subject to compatibility between the polyimide matrix and silica filler, and the inherent dielectric constant of silica is 4.0.…”

Section: Introductionmentioning

confidence: 99%

Low dielectric constant polyimide mixtures fabricated by polyimide matrix and polyimide microsphere fillers

Qiu

2020

Polymer International

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Polyimide microspheres were prepared via non-aqueous emulsion polymerization by using pyromellitic dianhydride (PMDA) as anhydride monomer and 2,2-bis(4-(4-aminophenoxy)phenyl)propane as amine monomer. The polyimide microspheres were well characterized by Fourier transform infrared spectroscopy, SEM and laser particle size analyzer. They were spherical in shape and monodisperse and their size was 31-33 ∼m. Polyimide mixtures formed by polyimide microspheres as fillers and polyimide composed of pyromellitic and dianhydride 4,4 0 -oxydianiline (ODA) as matrix were investigated with regard to thermal properties, dielectric properties and mechanical properties. With 10%-50% polyimide microspheres in the polyimide mixtures, the dielectric constants were 2.26-2.48 (1 MHz) and the loss tangents were 0.00663-0.00857 (1 MHz), which were both significantly lower than the values for ODA-PMDA polyimide. The decomposition temperature and glass transition temperature were above 440 and 290°C. The polyimide mixtures possessed excellent thermal resistance. When the percentage of polyimide microsphere addition was 30%, the polyimide mixtures had the largest tensile strength (128.50 MPa) and elongation at break (9.01%). These results indicate that the polyimide microspheres were used as both low dielectric fillers and reinforcing fillers.

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Ideal dielectric thermally conductive bismaleimide nanocomposites filled with polyhedral oligomeric silsesquioxane functionalized nanosized boron nitride

Abstract: NH2–POSS functionalized nanosized boron nitride fillers were performed to fabricate thermally conductive bismaleimide/diallylbisphenol A (BMI/DABA) nanocomposites combining excellent dielectric properties and outstanding thermal stabilities.

Cited by 158 publications

References 31 publications

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Silsesquioxane‐Containing Hybrid Nanomaterials: Fascinating Platforms for Advanced Applications

Low dielectric constant polyimide mixtures fabricated by polyimide matrix and polyimide microsphere fillers

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