Preparation and properties of epoxy/BN highly thermal conductive composites reinforced with SiC whisker

Tang, Dahang; Su, Ji; Kong, Miqiu; Zhao, Zhongguo; Yang, Qi; Huang, Yajiang; Liao, Xia; Niu, Yanhua

doi:10.1002/pc.23455

Cited by 35 publications

(21 citation statements)

References 46 publications

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“…A similar observation was made by Wattanakul et al [137], who found that increasing the chain length of four cationic surfactants, from dodecyl-, tetradecyl-, hexadecyl-to octadecyl trimethyl ammonium bromide, adsorbed onto the surface of BN particles was increasingly effective for enhancing the thermal conductivity, as a consequence of better wetting of the epoxy resin. In many cases the coupling agent, N-(β-aminoethyl)-γ-aminopropyl trimethoxysilane [54], APTES [68,74,82,131,138,148], or GPTMS [72,73,138,144,156], is added directly in the preparation of the epoxy-BN composite, usually with the help of a solvent such as acetone or ethyl alcohol, and without any prior functionalisation of the BN particles.…”

Section: Effect Of Surface Treatments and Coupling Agentsmentioning

confidence: 99%

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Hutchinson

Moradi

2020

Materials

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Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.

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Section: Effect Of Surface Treatments and Coupling Agentsmentioning

confidence: 99%

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Hutchinson

Moradi

2020

Materials

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“…Most straightforwardly, increasing the filler content in the composite can improve the thermal conductivity; for example, a thermal conductivity of 32.5 W/mK was reported when BN reached a loading fraction of 78.5 vol% in polybenzoxazine matrix . Surface modification of BN assists with homogenous dispersion of filler in resin matrix . Mixing multiple sized particles leads to high packing density and easy formation of conductive pathways .…”

Section: Introductionmentioning

confidence: 99%

Densely packed polymer/boron nitride composite for superior anisotropic thermal conductivity

Zhu

Wang

et al. 2017

Polymer Composites

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High heat conduction performance of electrical insulating composite is highly desired in thermal management of electronics. In this study, densely packed boron nitride (BN) composites with resin matrices of epoxy, polymethyl methacrylate, and an acrylic copolymer based binder were prepared through a solvent mediated mixing and compression molding method. The solvent mediated mixing assisted homogeneous dispersion; the compression molding removed excessive resin and led to alignment of BN flakes with high filler content. The resulted composites exhibited superior in‐plane thermal conductivity k// up to 21.3 W/mK and pronounced anisotropic heat conduction properties. The thermal conductivity was positively correlated with density bold-italicρ of a specimen in experimental. A presentation of thermal conductivity bold-italick=bold-italick|bold-italicρ was proposed, and the dependence of thermal conductivity on specimen density bolddbold-italicktrue(bold-italicρtrue)/bolddbold-italicρ > 0 was proven mathematically. The application of BN composite in LED thermal management was demonstrated. An epoxy/BN heat spreader was used to efficiently cool down a 0.3‐W LED. The cooling effect was close to that with Al board heat spreader. POLYM. COMPOS., 39:E1653–E1658, 2018. © 2017 Society of Plastics Engineers

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“…For example, Nikoo G. et al [34] used the relationship between normalized storage modulus and angular frequency as a method to compare the degree of dispersion of BN particles in a PA6 and cyclic olefin copolymer (COC) matrix; they found that BN particles had a better dispersion in the PA6 matrix than in the COC matrix due to better compatibility between PA6 and BN. Tang D. et al [35] studied the dispersion of KH550-modified BN in an epoxy matrix and its effect on the thermal conductivity and mechanical properties of the composite; it was found that KH550-BN could be more uniformly dispersed in the matrix than pristine BN, and the epoxy/KH550-BN composite had a relatively higher thermal conductivity. In addition, different processing methods have been found to have different effects on the thermal conductivity of composites.…”

Section: Introductionmentioning

confidence: 99%

Effect of Thermal Conductive Fillers on the Flame Retardancy, Thermal Conductivity, and Thermal Behavior of Flame-Retardant and Thermal Conductive Polyamide 6

et al. 2019

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In this work, polyamide 6 (PA6) composites with improved flame retardancy and thermal conductivity were prepared with different thermal conductive fillers (TC fillers) such as aluminum nitride (AlN) and boron nitride (BN) in a PA6 matrix with aluminum diethylphosphinate (AlPi) as a fire retardant. The resultant halogen-free flame retardant (HFFR) and thermal conductive (TC) PA6 (HFFR-TC-PA6) were investigated in detail with a mechanical property test, a limiting oxygen index (LOI), the vertical burning test (UL-94), a cone calorimeter, a thermal gravimetric analysis (TGA) and differential scanning calorimetry (DSC). The morphology of the impact fracture surface and char residue of the composites were analyzed by scanning electron microscopy (SEM). It was found that the thermal conductivity of the HFFR-TC-PA6 composite increased with the amount of TC fillers. The TC fillers exerted a positive effect for flame retardant PA6. For example, the HFFR-TC-PA6 composites with the thickness of 1.6 mm successfully passed the UL-94 V-0 rating with an LOI of more than 29% when the loading amount of AlN-550RFS, BN-SW08 and BN-NW04 was 30 wt%. The morphological structures of the char residues revealed that TC fillers formed a highly integrated char layer surface (without holes) during the combustion process, as compared to that of flame retardant PA6/AlPi composites. In addition, the thermal stability and crystallization behavior of the composites were studied.

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Preparation and properties of epoxy/BN highly thermal conductive composites reinforced with SiC whisker

Cited by 35 publications

References 46 publications

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Densely packed polymer/boron nitride composite for superior anisotropic thermal conductivity

Effect of Thermal Conductive Fillers on the Flame Retardancy, Thermal Conductivity, and Thermal Behavior of Flame-Retardant and Thermal Conductive Polyamide 6

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