Preparation and properties of polystyrene/SiCw/SiCp thermal conductivity composites

Abstract

The silicon carbide whisker (SiCw) and silicon carbide particle (SiCp) were employed to prepare polystyrene/silicon carbide whisker/silicon carbide particle (PS/SiCw/SiCp) thermal conductivity composites, and the titanate coupling reagent of NDZ-105 was introduced to functionalize the surface of fillers. The thermal conductive coefficient k improved from 0.18 W/mK for native PS to 1.29 W/mK for the composites with 40% volume fraction of SiCw/SiCp (volume fraction, 3 : 1) hybrid fillers. Both the thermal decomposition temperature and dielectric constant of the composites increased with the addition of SiCw/SiCp hybrid fillers. At the same addition of SiCw/SiCp hybrid fillers, the surface modification of hybrid fillers by NDZ-105 could improve the thermal conductivity and the mechanical properties of the composites. V C 2011 Wiley Periodicals, Inc. J Appl Polym Sci 124: [132][133][134][135][136][137] 2012

Double percolation of multiwalled carbon nanotubes in polystyrene/polylactic acid blends

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A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

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