Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites

Abstract

Benzocyclobutene-modified silsesquioxane (BCB-POSS) and divinyl tetramethyl disiloxane-bisbenzocyclobutene (DVS-BCB) prepolymer were introduced into the containing benzocyclobutene (BCB) unit matrix resin P(4-MB-co-1-MP) polymerized from 1-methyl-1-(4-benzocyclobutenyl) silacyclobutane (4-MSCBBCB) and 1-methyl-1-phenylsilacyclobutane (1-MPSCB), respectively. The low dielectric constant (low-k) siloxane/carbosilane hybrid benzocyclobutene resin composites, P(4-MB-co-1-MP)/BCB-POSS and P(4-MB-co-1-MP)/DVS-BCB, were prepared. The curing processes of the composites were assessed via Fourier-transform infrared spectroscopy (FTIR) and differential scanning calorimetry (DSC). The effects on dielectric properties and heat resistance of those composites with different proportion of BCB-POSS and DVS-BCB were investigated using an impedance analyzer and thermogravimetric analyzer (TGA), respectively. The thermal curing of composites could be carried out by ring-opening polymerization (ROP) of the BCB four-member rings of BCB-POSS or DVS-BCB and those of P(4-MB-co-1-MP). With increasing the proportion of BCB-POSS to 30%, the 5% weight loss temperature (T5%) of P(4-MB-co-1-MP)/BCB-POSS composites was raised visibly, whereas the dielectric constant (k) was decreased owing to the introduction of nanopores into POSS. For P(4-MB-co-1-MP)/DVS-BCB composites, the T5% and k were slightly raised with increasing the proportion of DVS-BCB. The above results indicated that the BCB-POSS showed advantages over conventional fillers to simultaneously improve thermostability and decrease k.

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

“…[165,166] For POSS-modified reinforced BCB resin, the simple strategy of hydrosilylation reaction is favored by people. [167,168] BCB-POSS composites with two different mechanisms of radical crosslinking of methacrylic acid and diazidenitro insertion were prepared by hydrosilylation reaction HAYES et al [169] and Hu et al [170] synthesized two novel BCB functionalized double-layer POSS monomers (2BCB-DDSQ and 4BCB-DDSQ) by hydrolysis condensation and hydrosilylation.…”

“…[ 165,166 ] For POSS‐modified reinforced BCB resin, the simple strategy of hydrosilylation reaction is favored by people. [ 167,168 ] BCB‐POSS composites with two different mechanisms of radical crosslinking of methacrylic acid and diazide‐nitro insertion were prepared by hydrosilylation reaction HAYES et al. [ 169 ] and Hu et al.…”

Phosphorus-Containing Flame-Retardant Benzocyclobutylene Composites with High Thermal Stability and Low CTE

“…Small molecules will not be produced during the curing process, which will not affect the process and the internal structure of the resin. At the same time, due to the highly cross-linked structure after curing, − the cured resin usually has good thermal stability and good dimensional stability . Meanwhile, the benzene ring contained in the BCB monomer is a rigid structure, which can provide certain mechanical properties to the resin and has a certain elastic modulus and hardness.…”

Polyarylene ether nitrile/divinyl siloxane‐bisbenzocyclobutene composite films: Curing reaction and thermal/mechanical/dielectric properties

“…19,20 Nevertheless, the dimensional stability, frequency stability, and intrinsic thermal conductivity of PENs are not well, which affect the safety and application of electronic fields in some extent. Divinyl siloxanebisbenzocyclobutene (BCB) as a thermosetting resin could be used in a variety of microelectronics applications owning to its advantages [21][22][23][24] of low-dielectric constant (2.6-2.7), thermal dimensional stability, outstanding T g , chemical stability, and mechanical processing. Most importantly, the BCB resin could undergo a cross-linking reaction between its molecules (Figure 1b), a low curing reaction temperature, and no need to add additional additives, while producing no by-products.…”